參數(shù)資料
型號: PLF8577C
廠商: NXP Semiconductors N.V.
英文描述: LCD direct/duplex driver with I2C-bus interface
中文描述: 液晶直接/雙工司機(jī)帶I2C總線接口
文件頁數(shù): 19/28頁
文件大?。?/td> 195K
代理商: PLF8577C
1998 Jul 30
19
Philips Semiconductors
Product specification
LCD direct/duplex driver with
I
2
C-bus interface
PCF8577C
13 CHIP DIMENSIONS AND BONDING PAD LOCATIONS
Fig.18 Bonding pad locations.
Chip area = 4.62 mm
2
.
Thickness = 381
±
25
μ
m.
n-substrate (back) connected to V
DD
.
Bonding pad dimensions = 110
μ
m
×
110
μ
m.
handbook, full pagewidth
MGA726
VDD
A2/BP2
BP1
V
S
S
A
A
S
S
S
S
S
S27
S26
S25
S24
S23
S22
S21
S20
S19
S18
S1
S2
S3
S4
S5
S6
S7
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
24
25
S
S
S
S
S
S
S
S
S
S
2.31
mm
2 mm
PCF8577C
x
y
0
0
handbook, halfpage
MBE924
Fig.19 Reference marks.
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