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參數(shù)資料
| 型號(hào)： | RENESAS |
| 英文描述： | Renesas Semiconductor Lead-Free PackagesCatalog 949K/MAR.19.03 |
| 中文描述： | 瑞薩半導(dǎo)體無鉛PackagesCatalog 949K/MAR.19.03 |
| 文件頁數(shù)： | 2/8頁 |
| 文件大?。?/td> | 949K |
| 代理商： | RENESAS |
Background to the Trend toward
Lead-Free Products
It is widely recognized that the absorption of lead into the human
body can lead to a variety of health problems.
To protect the environment against contamination by lead from
waste electronic equipment and components, there is a growing
worldwide movement to restrict the use of lead.
Semiconductor products are no exception, and moves are also
underway toward making Renesas semiconductor packages
lead-free.
The European Union has agreed to implement the RoHS directive
(the restriction of the use of certain Hazardous Substances in
electrical and elecironic equipment), starting in July 2006,
prohibiting the use of lead, mercury, cadmium, hexavalent
chromium, PBB (polybrominated biphenyls), and PBDE
(polybrominated diphenyl ethers).
This directive was published in the official journal of the
European Union in February 2003.
Lead-free packaging
The Renesas approach
Using lead free materials for semiconductors. Initially,
priority will be given to making terminals lead-free.*
The higher melting points of lead-free solders and the
resulting higher mounting temperatures require
enhanced heat resistance in components.
Technologies are under development for eliminating lead inside
packages, including sealing glass, and also die-bonding materials in
some products.
*
Heat-resistance improvement and provisions for mass
production of lead-free terminals have been completed
for all product families, and some products are already
in mass production. consult a Renesas sales
representative for the mass production details
concerning particular products.
The target date for the total abolition of lead from
terminals is end of 2005.
Lead-free products are differentiated from conventional
products by a "Pb-Free T." marking on the label of the
inner bag, box.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| REPLACEMENT_IC | Cross References |
| REPORT | Report - Lead (Pb)-Free Packaging Strategy 2000-2003 |
| RES-NETWORK | Interface IC |
| RES060L03 | TRANSISTOR | MOSFET | MATCHED PAIR | N-CHANNEL | 30V V(BR)DSS | 6A I(D) | SO |
| RES070N03 | TRANSISTOR | MOSFET | N-CHANNEL | 30V V(BR)DSS | 7A I(D) | SO |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| RENEWAL | 制造商:Altera Corporation 功能描述:SOFTWARE QUARTUS II PER SEAT 1YR |
| RENF00300 | 制造商:SHIELD 制造商全稱:SHIELD s.r.l. 功能描述:M8 with cable, straight, snap-in |
| RENF00400 | 制造商:SHIELD 制造商全稱:SHIELD s.r.l. 功能描述:M8 with cable, straight, snap-in |
| RENF00500 | 制造商:SHIELD 制造商全稱:SHIELD s.r.l. 功能描述:M8 with cable, straight, snap-in |
| RENF05100 | 制造商:SHIELD 制造商全稱:SHIELD s.r.l. 功能描述:M8 with cable, straight, snap-in |
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