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參數(shù)資料
| 型號(hào)： | RENESAS |
| 英文描述： | Renesas Semiconductor Lead-Free PackagesCatalog 949K/MAR.19.03 |
| 中文描述： | 瑞薩半導(dǎo)體無(wú)鉛PackagesCatalog 949K/MAR.19.03 |
| 文件頁(yè)數(shù)： | 5/8頁(yè) |
| 文件大?。?/td> | 949K |
| 代理商： | RENESAS |
Various test results
Shear strength of ball products
The joint strengths for Sn-Ag-Cu ball prodncts are equivalent to conventional products.
Package: 208-pin QFP (Alloy 42)
Temperature cycle test conditions: -55/125
°
C
Package: 20-pin SOP (Cu)
Temperature cycle test conditions: -55/125
°
C
Package: CMPAK-4 (Cu)
Temperature cycle test conditions: -55/125
°
C
Package: 100-pin QFP (Alloy 42)
Temperature cycle test conditions: -40/125
°
C
Package: 100-pin QFP (Cu)
Temperature cycle test conditions: -40/125
°
C
Number of temperature cycles
0
500
1000
0
2
4
6
8
10
Sn-Bi
Sn-Bi
Sn-Bi
Sn-Bi
Sn-Pb
Solder paste
Sn-3Ag-0.7Cu
Sn-2.5Ag-1Bi-0.5Cu
Sn-3Ag-3Bi-0.7Cu
Sn-37Pb
Sn-37Pb(Ref.)
0
500
1000
0
10
20
30
Number of temperature cycles
Sn-Bi
Sn-Bi
Sn-Bi
Sn-Pb
Solder paste
Sn-3Ag-0.5Cu
Sn-2.5Ag-1Bi-0.5Cu
Sn-37Pb
Sn-37Pb(Ref.)
Number of temperature cycles
Number of temperature cycles
500
0
1000
1500
2000
0
20
18
16
14
12
10
8
6
4
2
Sn-Cu
Sn-Cu
Sn-Cu
Sn-Cu
Sn-Cu
Sn-Pb
Solder paste
Sn-3.5Ag-0.7Cu
Sn-3.0Ag-0.5Cu
Sn-2.5Ag-05Cu-2.5Bi
Sn-8Zn-3Bi
Sn-37Pb
Sn-37Pb(Ref.)
500
0
1000
1500
2000
0
20
18
16
14
12
10
8
6
4
2
Sn-Cu
Sn-Cu
Sn-Cu
Sn-Cu
Sn-Cu
Sn-Pb
Solder paste
Sn-3.5Ag-0.7Cu
Sn-3.0Ag-0.5Cu
Sn-2.5Ag-05Cu-2.5Bi
Sn-8Zn-3Bi
Sn-37Pb
Sn-37Pb(Ref.)
0
500
1000
0
10
20
30
Number of temperature cycles
Ni/Pd/Au
Ni/Pd/Au
Ni/Pd/Au
Sn-Pb
Solder paste
Sn-3Ag-0.5Cu
Sn-2.5Ag-1Bi-0.5Cu
Sn-37Pb
Sn-37P(Ref.)
10
9
8
7
6
5
4
3
2
1
0
Sn-Ag-Cu ball
Sn-Pb ball
Package: 240-pin FBGA
Test conditions: Left at 150
°
C
Terminal surface
Terminal surface
Terminal surface
Terminal surface
Terminal surface
Storage time (h)
800
1000
600
400
200
0
Speed: 12 mm/min
Shear strength
45
°
Hook
Hook
45
°
pull
45
°
pull
45
°
pull
Shear
Vertical
pull
45
°
Hook
45
°
Hook
The joint strengths for both Alloy 42 and Cu lead frames are equivalent to conventional products (using Sn-Pb plating and Sn-Pb solder paste).
Joint strength test results of lead-free plating products
Joint strength test results of lead-free ball products
J
J
J
J
J
J
J
T
T
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相關(guān)PDF資料 |
PDF描述 |
|---|---|
| REPLACEMENT_IC | Cross References |
| REPORT | Report - Lead (Pb)-Free Packaging Strategy 2000-2003 |
| RES-NETWORK | Interface IC |
| RES060L03 | TRANSISTOR | MOSFET | MATCHED PAIR | N-CHANNEL | 30V V(BR)DSS | 6A I(D) | SO |
| RES070N03 | TRANSISTOR | MOSFET | N-CHANNEL | 30V V(BR)DSS | 7A I(D) | SO |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| RENEWAL | 制造商:Altera Corporation 功能描述:SOFTWARE QUARTUS II PER SEAT 1YR |
| RENF00300 | 制造商:SHIELD 制造商全稱(chēng):SHIELD s.r.l. 功能描述:M8 with cable, straight, snap-in |
| RENF00400 | 制造商:SHIELD 制造商全稱(chēng):SHIELD s.r.l. 功能描述:M8 with cable, straight, snap-in |
| RENF00500 | 制造商:SHIELD 制造商全稱(chēng):SHIELD s.r.l. 功能描述:M8 with cable, straight, snap-in |
| RENF05100 | 制造商:SHIELD 制造商全稱(chēng):SHIELD s.r.l. 功能描述:M8 with cable, straight, snap-in |
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