參數(shù)資料
型號: RENESAS
英文描述: Renesas Semiconductor Lead-Free PackagesCatalog 949K/MAR.19.03
中文描述: 瑞薩半導體無鉛PackagesCatalog 949K/MAR.19.03
文件頁數(shù): 6/8頁
文件大?。?/td> 949K
代理商: RENESAS
Solder ball connection reliability
Connection reliability of Sn-Ag-Cu balls is equivalent to conventional products.
Cross-sections of fillet shape after mounting on board
C
Sn-Bi plating vs Sn-Pb plating
Sn-Cu dipping vs Sn-Pb dipping
Sn-Ag-Cu ball vs Sn-Pb ball
Sn-Cu plating vs Sn-Pb plating
Ni/Pd/Au plating vs Sn-Pb plating
Sn-Bi plating
Conventional Sn-Pb plating
Sn-Ag-Cu ball
Sn-Cu dipping
Conventional Sn-Pb dipping
Conventional Sn-Pb ball
Sn-Cu plating
Conventional Sn-Pb plating
Ni/Pd/Au plating
Conventional Sn-Pb plating
Breakage evaluation with mounting
on both sides of board
Connection reliability evaluation
Test conditions
Temperature : -25/125
°
C
Time : 20 min/cycle
Package
240pin FBGA
Mounting board
FR-4
Number of temperature cycles
99.9
99.0
95.0
90.0
50.0
30.0
15.0
10.0
5.0
2.0
1.0
0.5
00.3
0.1
100
1000
10000
10
Solder ball : Sn-Ag-Cu
Solder paste : Sn-Ag-Cu
Solder ball : Sn-Pb
Solder paste : Sn-Pb
相關PDF資料
PDF描述
REPLACEMENT_IC Cross References
REPORT Report - Lead (Pb)-Free Packaging Strategy 2000-2003
RES-NETWORK Interface IC
RES060L03 TRANSISTOR | MOSFET | MATCHED PAIR | N-CHANNEL | 30V V(BR)DSS | 6A I(D) | SO
RES070N03 TRANSISTOR | MOSFET | N-CHANNEL | 30V V(BR)DSS | 7A I(D) | SO
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