參數(shù)資料
型號(hào): RENESAS
英文描述: Renesas Semiconductor Lead-Free PackagesCatalog 949K/MAR.19.03
中文描述: 瑞薩半導(dǎo)體無鉛PackagesCatalog 949K/MAR.19.03
文件頁數(shù): 3/8頁
文件大?。?/td> 949K
代理商: RENESAS
Lead-free packaging
Lead-free specifications
IR/air reflow profiles of small, thin packages and large, thick packages
Surface finish of lead
Making terminals lead-free
Lead-free soldering generally requires higher reflow temperature. Renesas has set the heat-resisting temperature of a surface-
mount type package at 260
°
C or 245
°
C to withstand mounting with an Sn-Ag-Cu or similar high-melting-point lead-free solder.
Solder heat-resistance is defined by the package surface temperature, and an appropriate temperature profile is offered according
to the heat capacity of the package. Heat-resistance reflow profiles of small, thin packages and large, thick packages are shown
below.
Solder balls
Information is available on an individual basis for devices that do not conform to the profiles shown below.
Making package terminals lead-free
Improving heat resistance
Sn-Pb plating
Ni/Pd/Au plating
Same as conventional specifications
Sn-Ag-Cu ball
Sn-Bi plating
Sn-Cu plating
Sn-Cu plating
Sn-Bi plating
Ni/Pd/Au plating
Package
Conventional specifications
Lead-free specifications
Surface-mount type
(SMD)
Pin insertion type
(THD)
Sn-Pb plating
Sn-Pb dipping
Sn-Cu plating
Au plating
Sn-Cu dipping
Ni/Pd/Au plating
Same as conventional specifications
Same as conventional specifications
Sn-Pb ball
相關(guān)PDF資料
PDF描述
REPLACEMENT_IC Cross References
REPORT Report - Lead (Pb)-Free Packaging Strategy 2000-2003
RES-NETWORK Interface IC
RES060L03 TRANSISTOR | MOSFET | MATCHED PAIR | N-CHANNEL | 30V V(BR)DSS | 6A I(D) | SO
RES070N03 TRANSISTOR | MOSFET | N-CHANNEL | 30V V(BR)DSS | 7A I(D) | SO
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
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