參數(shù)資料
型號： RH80532NC017256
元件分類： 微處理器
英文描述： Microprocessor
中文描述： 微處理器
文件頁數(shù)： 60/93頁
文件大小： 2353K
代理商： RH80532NC017256
Mobile Intel
Pentium
4 Processor-M Datasheet
60
Datasheet
250686-002
Table 33. Micro-FCPGA Package Dimensions
NOTES:
1. All Dimensions are Preliminary and subject to change. Values shown are for reference only.
2. Overall height with socket is based on design dimensions of the Micro-FCPGA package and socket with no
thermal solution attached. Values were based on design specifications and tolerances. This dimension is
subject to change based on socket design, OEM motherboard design, or OEM SMT process.
Symbol Parameter
Min
Max
Unit
A
Overall height, top of die to package seating plane
1.81
2.03
mm
-
Overall height, top of die to PCB surface, including socket(1)
4.69
5.15
mm
A1
Pin length
1.95
2.11
mm
A2
Die height
0.854
mm
A3
Pin-side capacitor height
-
1.25
mm
B
Pin diameter
0.28
0.36
mm
D
Package substrate length
34.9
35.1
mm
E
Package substrate width
34.9
35.1
mm
D1
Die length
12.24
mm
E1
Die width
11.93
mm
e
Pin pitch
1.27
mm
K
Package edge keep-out
5
mm
K1
Package corner keep-out
7
mm
K3
Pin-side capacitor boundary
14
mm
-
Pin tip radial true position
<=0.254
mm
N
Pin count
478
each
Pdie
Allowable pressure on the die for thermal solution
-
689
kPa
W
Package weight
4.5
g
Package Surface Flatness
0.286
mm
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