參數(shù)資料
型號: S71GL064A08BAI0F3
廠商: SPANSION LLC
元件分類: 存儲器
英文描述: Stacked Multi-Chip Product (MCP) Flash Memory and RAM
中文描述: SPECIALTY MEMORY CIRCUIT, PBGA56
封裝: 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56
文件頁數(shù): 108/134頁
文件大小: 2383K
代理商: S71GL064A08BAI0F3
February 8, 2005 S71GL064A_00_A2
S71GL064A based MCPs
73
Advance
Informatio n
Notes:
1. Figure indicates last two bus cycles of a program or erase operation.
2. PA = program address, SA = sector address, PD = program data.
3. DQ7# is the complement of the data written to the device. DOUT is the data written to the device.
4. Illustration shows device in word mode.
Figure 24. Alternate CE# Controlled Write (Erase/Program) Operation Timings
tGHEL
tWS
OE#
CE#
WE#
RESET#
tDS
Data
tAH
Addresses
tDH
tCP
DQ7#
DOUT
tWC
tAS
tCPH
PA
Data# Polling
PBD for program
55 for erase
tRH
tWHWH1 or 2
tPOLL
RY/BY#
tWH
29 for program buffer to flash
30 for sector erase
10 for chip erase
PBA for program
2AA for erase
SA for program buffer to flash
SA for sector erase
555 for chip erase
tBUSY
相關(guān)PDF資料
PDF描述
S71GL064A08BAW0B3 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A08BAW0F3 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A08BFI0B2 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A08BFI0B3 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A08BFI0F3 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
相關(guān)代理商/技術(shù)參數(shù)
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S71GL064A08BAW0B0 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
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S71GL064A08BAW0F0 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
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