參數(shù)資料
型號(hào): S71GL064A08BAI0F3
廠商: SPANSION LLC
元件分類: 存儲(chǔ)器
英文描述: Stacked Multi-Chip Product (MCP) Flash Memory and RAM
中文描述: SPECIALTY MEMORY CIRCUIT, PBGA56
封裝: 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56
文件頁數(shù): 37/134頁
文件大小: 2383K
代理商: S71GL064A08BAI0F3
February 8, 2005 S71GL064A_00_A2
Type 1 SRAM
129
Advance
Informatio n
Notes:
1. tHZ and tOHZ are defined as the time at which the outputs achieve the open circuit conditions and are not referenced to
output voltage levels.
2. At any given temperature and voltage condition, tHZ(Max.) is less than tLZ(Min.) both for a given device and from
device to device interconnection.
Figure 60. Timing Waveform of Read Cycle(2) (WE#=VIH, if BYTE# is Low, Ignore UB#/LB# Timing)
Figure 61. Timing Waveform of Write Cycle(1) (WE# controlled, if BYTE# is Low, Ignore UB#/LB# Timing)
High-Z
tRC
tOH
tAA
tCO1
tBA
tOE
tOLZ
tBLZ
tLZ
tOHZ
tBHZ
tHZ
tCO2
Address
CS1#
CS2
UB#, LB#
OE#
Data out
Data Valid
tWC
tCW(2)
tWR(4)
tAW
tBW
tWP(1)
tAS(3)
tDH
tDW
tWHZ
tOW
High-Z
tCW(2)
Address
CS1#
CS2
UB#, LB#
WE#
Data in
Data out
Data Undefined
Data Valid
相關(guān)PDF資料
PDF描述
S71GL064A08BAW0B3 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A08BAW0F3 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A08BFI0B2 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A08BFI0B3 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A08BFI0F3 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
S71GL064A08BAW0B0 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A08BAW0B2 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A08BAW0B3 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A08BAW0F0 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A08BAW0F2 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM