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| 型號： | SST89C58RC-40-I-TQJE |
| 廠商： | Microchip Technology |
| 文件頁數(shù)： | 71/88頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC MCU 8BIT FLASH 40TQFP |
| 標準包裝： | 160 |
| 系列： | FlashFlex® |
| 核心處理器： | 8051 |
| 芯體尺寸： | 8-位 |
| 速度： | 40MHz |
| 連通性： | EBI/EMI，I²C，SMBus，UART/USART |
| 外圍設備： | 欠壓檢測/復位，POR，WDT |
| 輸入/輸出數(shù)： | 32 |
| 程序存儲器容量： | 32KB（32K x 8） |
| 程序存儲器類型： | 閃存 |
| EEPROM 大?。?/td> | 2K x 8 |
| RAM 容量： | 1K x 8 |
| 電壓 - 電源 (Vcc/Vdd)： | 2.7 V ~ 5.5 V |
| 振蕩器型： | 外部 |
| 工作溫度： | -40°C ~ 85°C |
| 封裝/外殼： | 44-TQFP |
| 包裝： | 托盤 |
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2011 Silicon Storage Technology, Inc.
DS25100A
12/11
73
FlashFlex MCU
SST89C58RC
Data Sheet
A Microchip Technology Company
Electrical Specification
Note: This specification contains preliminary information on new products in production. The specifications are subject to
change without notice.
Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute
Maximum Stress Ratings” may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these conditions or conditions greater than those defined in the
operational sections of this data sheet is not implied. Exposure to absolute maximum stress rating con-
ditions may affect device reliability.)
Ambient Temperature Under Bias ...................................... -55°C to +125°C
Storage Temperature................................................. -65°C to +150°C
Voltage on EA# Pin to VSS.............................................. -0.5V to +14.0V
D.C. Voltage on Any Pin to Ground Potential ............................. -0.5V to VDD+0.5V
Transient Voltage (<20ns) on Any Other Pin to VSS ........................ -1.0V to VDD+1.0V
Maximum IOL per I/O Pins P1.4, P1.5, P1.6, P1.7 .................................... 20mA
Maximum IOL per I/O for All Other Pins ............................................ 15mA
Package Power Dissipation Capability (TA = 25°C)................................... 1.5W
Through Hole Lead Soldering Temperature (10 Seconds) ............................ 300°C
Surface Mount Solder Reflow Temperature1 ........................... 260°C for 10 seconds
1. Excluding certain with-Pb 32-PLCC units, all packages are 260
°C capable in both non-Pb and with-Pb solder versions.
Certain with-Pb 32-PLCC package types are capable of 240
°C for 10 seconds; please consult the factory for the latest information.
Output Short Circuit Current2 .................................................. 50mA
2. Outputs shorted for no more than one second. No more than one output shorted at a time.
(Based on package heat transfer limitations, not device power consumption.
Table 29:Operating Range
Symbol
Description
Min.
Max
Unit
TA
Ambient Temperature Under Bias
Standard
0
+70
°C
Industrial
-40
+85
°C
VDD
Supply Voltage
SST89C58RC
2.7
5.5
V
FOSC
Oscillator Frequency
SST89C58RC
0
40
MHz
Oscillator Frequency for In-Application programming
SST89C58RC
25
40
MHz
T0-0.1 25100
Table 30:Reliability Characteristics
Symbol
Parameter
Minimum Specification
Units
Test Method
NEND1
1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.
Endurance
10,000
Cycles
JEDEC Standard A117
TDR1
Data Retention
100
Years
JEDEC Standard A103
ILTH1
Latch Up
100 + IDD
mA
JEDEC Standard 78
T0-0.0 25100
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