參數(shù)資料
型號(hào)： TDA1517A
廠商： NXP Semiconductors N.V.
英文描述： 8 W BTL or 2 x 4 W SE power amplifier
中文描述： 8糯橋接或2 × 4瓦東南功率放大器
文件頁(yè)數(shù)： 10/20頁(yè)
文件大?。?/td> 132K
代理商： TDA1517A
2001 Apr 17
10
Philips Semiconductors
Product specification
8 W BTL or 2
×
4 W SE power amplifier
TDA1517ATW
Thermal behaviour (PCB design considerations)
The typical thermal resistance [R
th(j-a)
] of the IC in the
HTSSOP20 package is 37 K/W if the IC is soldered on a
printed-circuit board with double sided 35
μ
m copper with
a minimum area of approximately 30 cm
2
. The actual
usable thermal resistance depends strongly on the
mounting method of the device on the printed-circuit
board, the soldering method and the area and thickness of
the copper on the printed-circuit board.
The bottom ‘heat-spreader’ of the IC has to be soldered
efficiently on the ‘thermal land’ of the copper area of the
printed-circuit board using the re-flow solder technique.
A number of thermal vias in the ‘thermal land’ provide a
thermal path to the opposite copper site of the
printed-circuit board. The size of the surface layers should
be as large as needed to dissipate the heat.
The thermal vias (0.3 mm
) in the ‘thermal land’ should
not use web construction techniques, because those will
have high thermal resistance; continuous connection
completely around the via-hole is recommended.
For a maximum ambient temperature of 60
°
C the
following calculation can be made: for the application at
V
P
= 12 V and R
L
= 8
the (ALL-) music power
dissipation approximately 2.0 W;
T
j(max)
= T
amb
+ P
×
R
th(j-a)
= 60
°
C + 2.0
×
37 = 134
°
C.
Note: the above calculation holds for application at
‘a(chǎn)verage listening level’ music output signals. Applying (or
testing) with sine wave signals will produce approximately
twice the music power dissipation; at worst case condition
this can activate the maximum temperature protection.
handbook, full pagewidth
60
50
40
30
20
10
0
K/W
1
0
number of 35
μ
m copper layers
2
3
4
CU-LAYER 2-4
MGU306
L
L
ON-BOARD-COOLING
COPPER DESIGN
CU-LAYER 1
Rth(j-a)
Rth(j-p)
Fig.5 Thermal resistance of the HTSSOP20 mounted on printed-circuit board.
R
th(j-p)
curve is given for practical calculation purpose.
L = 30 mm plus vias
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TDA1517ATW 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:8 W BTL or 2 x 4 W SE power amplifier
TDA1517ATW/N1 制造商:NXP Semiconductors 功能描述:AMP AUDIO PWR 8W STER 20TSSOP 制造商:NXP Semiconductors 功能描述:AMP, AUDIO, PWR, 8W, STER, 20TSSOP
TDA1517ATW/N1,112 功能描述:音頻放大器 8W BTL.M. MEDIA AMP RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
TDA1517ATW/N1,118 功能描述:音頻放大器 W BTL/2X4 W SE AMP RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
TDA1517ATW/N1112 制造商:NXP Semiconductors 功能描述:IC AUDIO AMP AB 8W TSSOP-20
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