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參數(shù)資料
| 型號： | TDA1517A |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | 8 W BTL or 2 x 4 W SE power amplifier |
| 中文描述： | 8糯橋接或2 × 4瓦東南功率放大器 |
| 文件頁數(shù)： | 16/20頁 |
| 文件大?。?/td> | 132K |
| 代理商： | TDA1517A |
2001 Apr 17
16
Philips Semiconductors
Product specification
8 W BTL or 2
×
4 W SE power amplifier
TDA1517ATW
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
BGA, HBGA, LFBGA, SQFP, TFBGA
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS
PLCC
(3)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
not suitable
(2)
suitable
not recommended
(3)(4)
not recommended
(5)
suitable
suitable
suitable
suitable
suitable
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TDA1517ATW | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:8 W BTL or 2 x 4 W SE power amplifier |
| TDA1517ATW/N1 | 制造商:NXP Semiconductors 功能描述:AMP AUDIO PWR 8W STER 20TSSOP 制造商:NXP Semiconductors 功能描述:AMP, AUDIO, PWR, 8W, STER, 20TSSOP |
| TDA1517ATW/N1,112 | 功能描述:音頻放大器 8W BTL.M. MEDIA AMP RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| TDA1517ATW/N1,118 | 功能描述:音頻放大器 W BTL/2X4 W SE AMP RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| TDA1517ATW/N1112 | 制造商:NXP Semiconductors 功能描述:IC AUDIO AMP AB 8W TSSOP-20 |
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