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參數(shù)資料
| 型號： | TGF2961-SD |
| 廠商： | TRIQUINT SEMICONDUCTOR INC |
| 元件分類： | 功率晶體管 |
| 英文描述： | Zener Diode; Application: General; Pd (mW): 500; Vz (V): 8.3 to 9.1; Condition Iz at Vz (mA): 5; C (pF) max: -; Condition VR at C (V):   ESD (kV) min: -; Package: LLD |
| 中文描述： | S BAND, Si, N-CHANNEL, RF POWER, HFET |
| 封裝： | ROHS COMPLIANT PACKAGE-3 |
| 文件頁數(shù)： | 19/20頁 |
| 文件大小： | 671K |
| 代理商： | TGF2961-SD |
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com
19
TGF2961-SD
August 2007 Rev A
1/ The lowest possible thermal and electrical resistance for Pin 2 is critical for optimal performance. The array
of vias under Pin 2 should be as small and as dense as the PC board fabrication permits. 0.30 mm diameter
vias on 0.60 mm center to center spacing is recommended.
2/ Mounting screws in the vicinity of the package improve heat transfer to the chassis or to a heat spreader
located on the backside of the PC board. Shown are clearance holes and solder mask keepout zone for a 2-
56 socket head cap screw. Use of a split lockwasher and proper torque on the screw will prevent
compression damage to the PC board.
3/ Use of 1 oz copper (min) in the PC board construction is recommended.
4/ For lowest thermal resistance, solder mask must be removed where the copper traces on the PC board
contact the heat spreader. In this example, this would be a) front and backsides of the PC board around the
2-56 screw and b) front of the PC board around package pin 2.
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
Recommended Assembly Diagram
2.6 mm CLEARANCE HOLE
FOR 2-56 SOCKET HEAD CAP SCREW (2/)
4.6 mm SOLDERMASK
KEEPOUT FOR 2-56 LOCKWASHER (4/)
SOT-89 PACKAGE OUTLINE
ARRAY OF VIAS (1/)
7.6 X 7.6 mm COPPER AREA (3/)
1
2
3
Assembly Notes
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
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| TGF2961-SD-T/R | 功能描述:射頻GaAs晶體管 DC-4Hz 1 Watt HFET RoHS:否 制造商:TriQuint Semiconductor 技術(shù)類型:pHEMT 頻率:500 MHz to 3 GHz 增益:10 dB 噪聲系數(shù): 正向跨導(dǎo) gFS（最大值/最小值）:4 S 漏源電壓 VDS: 閘/源擊穿電壓:- 8 V 漏極連續(xù)電流:3 A 最大工作溫度:+ 150 C 功率耗散:10 W 安裝風(fēng)格: 封裝 / 箱體: |
| TGF30-07870787-020 | 功能描述:THERMAL GAP FILLER/SKY BLUE 3.0W 制造商:leader tech inc. 系列:TGF30 零件狀態(tài):在售 使用:片狀 形狀:方形 外形:199.90mm x 199.90mm 厚度:0.0200"（0.508mm） 材料:氧化鋁填充硅膠 粘合劑:膠粘 - 兩側(cè) 底布，載體:- 顏色:藍(lán)色 熱阻率:0.90°C/W 導(dǎo)熱率:3.0 W/m-K 標(biāo)準(zhǔn)包裝:25 |
| TGF30-07870787-039 | 功能描述:THERMAL GAP FILLER/SKY BLUE 3.0W 制造商:leader tech inc. 系列:TGF30 零件狀態(tài):在售 使用:片狀 形狀:方形 外形:199.90mm x 199.90mm 厚度:0.0390"（0.991mm） 材料:氧化鋁填充硅膠 粘合劑:膠粘 - 兩側(cè) 底布，載體:- 顏色:藍(lán)色 熱阻率:0.90°C/W 導(dǎo)熱率:3.0 W/m-K 標(biāo)準(zhǔn)包裝:25 |
| TGF30-07870787-059 | 功能描述:THERMAL GAP FILLER/SKY BLUE 3.0W 制造商:leader tech inc. 系列:TGF30 零件狀態(tài):在售 使用:片狀 形狀:方形 外形:199.90mm x 199.90mm 厚度:0.0591"（1.500mm） 材料:氧化鋁填充硅膠 粘合劑:膠粘 - 兩側(cè) 底布，載體:- 顏色:藍(lán)色 熱阻率:0.90°C/W 導(dǎo)熱率:3.0 W/m-K 標(biāo)準(zhǔn)包裝:25 |
| TGF30-07870787-079 | 功能描述:THERMAL GAP FILLER/SKY BLUE 3.0W 制造商:leader tech inc. 系列:TGF30 零件狀態(tài):在售 使用:片狀 形狀:方形 外形:199.90mm x 199.90mm 厚度:0.0790"（2.007 mm） 材料:氧化鋁填充硅膠 粘合劑:膠粘 - 兩側(cè) 底布，載體:- 顏色:藍(lán)色 熱阻率:0.90°C/W 導(dǎo)熱率:3.0 W/m-K 標(biāo)準(zhǔn)包裝:25 |
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