參數(shù)資料
型號: THS770012IRGET
廠商: TEXAS INSTRUMENTS INC
元件分類: 模擬信號調(diào)理
英文描述: SPECIALTY ANALOG CIRCUIT, PQCC24
封裝: GREEN, PLASTIC, VQFN-24
文件頁數(shù): 17/35頁
文件大小: 1305K
代理商: THS770012IRGET
SLOS669B
– FEBRUARY 2010 – REVISED MAY 2011
EVM AND LAYOUT RECOMMENDATIONS
Figure 37 is the THS770012RGE EVM schematic, and Figure 43 through Figure 46 show the layout details of the
EVM PCB. Table 5 is the bill of materials for the EVM as supplied from TI. It is recommended to follow the layout
of the external components as close as possible to the amplifier, ground plane construction, and power routing.
General layout guidelines are:
1. Place a 2.2
F to 10F capacitor on each supply pin within 2 inches from the device. It can be shared among
other op amps.
2. Place a 0.01
F to 0.1F capacitor on each supply pin to ground as close as possible to the device.
Placement within 1mm of the device supply pins ensures best performance.
3. Keep output traces as short as possible to minimize parasitic capacitance and inductance. Doing so reduces
unwanted characteristics such as peaking in the frequency response, overshoot, and ringing in the pulse
response, and results in a more stable design.
4. To reduce parasitic capacitance, ground plane and power-supply planes should be removed from device
output pins.
5. The VOCM pin must be biased to a voltage between 2.25V to 2.75V for proper operation. Place a 0.1F to
0.22
F capacitor to ground as close as possible to the device to prevent noise coupling into the
common-mode.
6. For best performance, drive circuits and loads should be balanced and biased to keep the input and output
common-mode voltage between 2.25V to 2.75V. AC-coupling is a simple way to achieve this performance.
7. The THS770012 is provided in a thermally enhanced PowerPAD
package. The package is constructed
using a downset leadframe on which the die is mounted. This arrangement results in low thermal resistance
to the thermal pad on the underside of the package. Excellent thermal performance can be achieved by
following the guidelines in TI application reports SLMA002, PowerPAD
Made Easy. For proper operation, the thermal pad on the bottom of the device must
be tied to the same voltage potential as the GND pin on the device.
Figure 44. EVM Layout: Bottom Layer
Figure 43. EVM Layout: Top Layer
24
Copyright
2010–2011, Texas Instruments Incorporated
相關(guān)PDF資料
PDF描述
THS8083-95CPZP SPECIALTY CONSUMER CIRCUIT, PQFP100
THS8083APZP SPECIALTY CONSUMER CIRCUIT, PQFP100
THS8083APZPG4 SPECIALTY CONSUMER CIRCUIT, PQFP100
THS8083CPZP SPECIALTY CONSUMER CIRCUIT, PQFP100
THS8133ACPHP PARALLEL, WORD INPUT LOADING, 0.005 us SETTLING TIME, 10-BIT DAC, PQFP48
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
THS788 制造商:TI 制造商全稱:Texas Instruments 功能描述:QUAD-CHANNEL TIME MEASUREMENT UNIT (TMU)
THS788PFD 功能描述:計時器和支持產(chǎn)品 Quad Ch Time Msmt Unit RoHS:否 制造商:Micrel 類型:Standard 封裝 / 箱體:SOT-23 內(nèi)部定時器數(shù)量:1 電源電壓-最大:18 V 電源電壓-最小:2.7 V 最大功率耗散: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝:Reel
THS788PFDT 功能描述:計時器和支持產(chǎn)品 Quad Ch Time Msmt Unit RoHS:否 制造商:Micrel 類型:Standard 封裝 / 箱體:SOT-23 內(nèi)部定時器數(shù)量:1 電源電壓-最大:18 V 電源電壓-最小:2.7 V 最大功率耗散: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝:Reel
THS789PFD 制造商:Texas Instruments 功能描述:Time Measurement Unit (TMU) 100-Pin HTQFP EP Tray 制造商:Texas Instruments 功能描述:IC TIME MEASUREMNT UNIT 100HTQFP 制造商:Texas Instruments 功能描述:THS789PFD
THS7BAT 功能描述:電池組 Rechargeable NICD For THS700 series RoHS:否 制造商:Ultralife 電池大小: 電池數(shù)量: 輸出電壓:3.7 V 容量: 化學性質(zhì):Lithium 端接類型:Wire