參數(shù)資料
型號： TMS320C6727B_07
廠商： Texas Instruments, Inc.
元件分類： 數(shù)字信號處理
英文描述： Floating-Point Digital Signal Processors
中文描述： 浮點數(shù)字信號處理器
文件頁數(shù)： 112/116頁
文件大?。?/td> 999K
代理商： TMS320C6727B_07
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
HTQFP
Package
Drawing
RFP
Pins Package
Qty
60
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
TMS320C6720BRFP200
ACTIVE
144
Green (RoHS &
no Sb/Br)
Green (RoHS &
no Sb/Br)
Green (RoHS &
no Sb/Br)
Green (RoHS &
no Sb/Br)
TBD
TBD
TBD
Green (RoHS &
no Sb/Br)
Green (RoHS &
no Sb/Br)
TBD
Green (RoHS &
no Sb/Br)
TBD
TBD
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-4-260C-72 HR
TMS320C6722BRFP200
ACTIVE
HTQFP
RFP
144
60
CU NIPDAU
Level-4-260C-72 HR
TMS320C6722BRFP250
ACTIVE
HTQFP
RFP
144
60
CU NIPDAU
Level-4-260C-72 HR
TMS320C6726BRFP266
ACTIVE
HTQFP
RFP
144
60
CU NIPDAU
Level-4-260C-72 HR
TMS320C6727BGDH275
TMS320C6727BGDH300
TMS320C6727BGDH350
TMS320C6727BZDH275
ACTIVE
ACTIVE
ACTIVE
ACTIVE
BGA
BGA
BGA
BGA
GDH
GDH
ZDH
ZDH
256
256
256
256
90
90
90
90
Call TI
SNPB
Call TI
SNAGCU
Call TI
Level-3-220C-168 HR
Call TI
Level-3-260C-168 HR
TMS320C6727BZDH300
ACTIVE
BGA
ZDH
256
90
SNAGCU
Level-3-260C-168 HR
TMS320C6727BZDH350
TMSDC6722BRFPA225
ACTIVE
ACTIVE
BGA
HTQFP
ZDH
RFP
256
144
90
60
Call TI
CU NIPDAU
Call TI
Level-4-260C-72 HR
TMSDC6726BRFPA225
TMSDC6727BGDHA250
TMSDC6727BZDHA250
ACTIVE
ACTIVE
ACTIVE
HTQFP
BGA
BGA
RFP
GDH
ZDH
144
256
256
60
90
90
Call TI
SNPB
SNAGCU
Call TI
Level-3-220C-168 HR
Level-3-260C-168 HR
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent
for the latest availability information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:
The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com
17-Oct-2007
Addendum-Page 1
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TMS320C6727BGDH275 制造商:Texas Instruments 功能描述:DSP FLOATING PT 32BIT/64BIT 275MHZ 2200MIPS 256BGA - Trays
TMS320C6727BGDH300 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC Floating-Point DSP RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT
TMS320C6727BGDH350 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC Floating-Point DSP RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT
TMS320C6727BZDH250 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC Floating-Pt Dig RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT
TMS320C6727BZDH275 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC Floating-Point DSP RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT
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