Table 512 an" />
參數(shù)資料
型號: TMS320VC5409GGU100
廠商: Texas Instruments
文件頁數(shù): 58/93頁
文件大小: 0K
描述: IC DIG SIG PROCESSOR 144-BGA
標準包裝: 160
系列: TMS320C54x
類型: 定點
接口: 主機接口,McBSP
時鐘速率: 100MHz
非易失內(nèi)存: ROM(32 kB)
芯片上RAM: 64kB
電壓 - 輸入/輸出: 3.30V
電壓 - 核心: 1.80V
工作溫度: -40°C ~ 100°C
安裝類型: 表面貼裝
封裝/外殼: 144-LFBGA
供應(yīng)商設(shè)備封裝: 144-BGA MICROSTAR(12x12)
包裝: 托盤
配用: 296-15829-ND - DSP STARTER KIT FOR TMS320C5416
其它名稱: 296-10763
296-10763-5
296-10763-5-ND
Documentation Support
61
April 1999 Revised October 2008
SPRS082F
5.8
Ready Timing for Externally Generated Wait States
Table 512 and Table 513 assume testing over recommended operating conditions and H = 0.5tc(CO) (see
Figure 59, Figure 510, Figure 511, and Figure 512).
Table 512. Ready Timing Requirements for Externally Generated Wait States
MIN
MAX
UNIT
tsu(RDY)
Setup time, READY before CLKOUT low
7
ns
th(RDY)
Hold time, READY after CLKOUT low
0
ns
tv(RDY)MSTRB
Valid time, READY after MSTRB low
4H9
ns
th(RDY)MSTRB
Hold time, READY after MSTRB low
4H
ns
tv(RDY)IOSTRB
Valid time, READY after IOSTRB low
5H9
ns
th(RDY)IOSTRB
Hold time, READY after IOSTRB low
5H
ns
The hardware wait states can be used only in conjunction with the software wait states to extend the bus cycles. To generate wait states using
READY, at least two software wait states must be programmed.
These timings are included for reference only. The critical timings for READY are those referenced to CLKOUT.
Table 513. Ready Switching Characteristics for Externally Generated Wait States
PARAMETER
MIN
MAX
UNIT
td(MSCL)
Delay time, CLKOUT low to MSC low
0
3
ns
td(MSCH)
Delay time, CLKOUT low to MSC high
0
3
ns
The hardware wait states can be used only in conjunction with the software wait states to extend the bus cycles. To generate wait states by READY,
at least two software wait states must be programmed. READY is not sampled until the completion of the internal software wait states.
MSC
MSTRB
READY
A[22:0]
CLKOUT
tv(MSCH)
tv(MSCL)
th(RDY)
th(RDY)MSTRB
tv(RDY)MSTRB
Wait State
Generated
by READY
Wait States
Generated Internally
tsu(RDY)
NOTE A: A[22:16] apply to DMA accesses to extended I/O, DATA, PROGRAM memory. The CPU has access to only extended
PROGRAM memory.
Figure 59. Memory Read With Externally Generated Wait States
相關(guān)PDF資料
PDF描述
TMS470R1A384PZQ IC RISC MCU 384K FLASH 100-LQFP
TMX320DM365BZCE IC DIGITAL MEDIA SOC 338NFBGA
TMX320F28069UPFPA IC MCU 32BIT 128KB FLASH 80HTQFP
TPS2371PWRG4 IC PWR INTRFCE SW FOR POE 8TSSOP
TS3A24157RSERG4 IC SWITCH DUAL SPDT 10UQFN
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TMS320VC5409GGU-80 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC Fixed-Pt Dig Signal Proc RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風格:SMD/SMT
TMS320VC5409PGE100 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC Fixed-Pt Dig Sig Proc RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風格:SMD/SMT
TMS320VC5409PGE100 制造商:Texas Instruments 功能描述:Digital Signal Processor IC
TMS320VC5409PGE-80 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC Fixed-Pt Dig Signal Proc RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風格:SMD/SMT
TMS320VC5409ZGU100 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC Fixed-Pt Dig Signal Proc RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風格:SMD/SMT