TMS320F2810, TMS320F2812
DIGITAL SIGNAL PROCESSORS
SPRS174B
–
APRIL 2001
–
REVISED SEPTEMBER 2001
96
POST OFFICE BOX 1443
HOUSTON, TEXAS 77251
–
1443
device and development support tool nomenclature
To designate the stages in the product development cycle, Texas Instruments assigns prefixes to the part
numbers of all TMS320
DSP devices and support tools. Each TMS320
DSP member has one of three
prefixes: TMX, TMP, or TMS. Texas Instruments recommends two of three possible prefix designators for its
support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from
engineering prototypes (TMX/TMDX) through fully qualified production devices/tools (TMS/TMDS). This
development flow is defined below.
Support tool development evolutionary flow:
TMDX
Development support product that has not completed TI
’
s internal qualification testing
TMDS
Fully qualified development support product
TMX and TMP devices and TMDX development support tools are shipped against the following disclaimer:
“
Developmental product is intended for internal evaluation purposes.
”
TMS devices and TMDS development support tools have been fully characterized, and the quality and reliability
of the device have been fully demonstrated. TI
’
s standard warranty applies.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type
(for example, PBK) and temperature range (for example, A). Figure 23 provides a legend for reading the
complete device name for any TMS320x28x family member. Refer to the timing section for specific options that
are available on F2810 and F2812 devices.
Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard production
devices. Texas Instruments recommends that these devices not be used in any production system because their
expected end-use failure rate still is undefined. Only qualified production devices are to be used.
PREFIX
TMX =
TMP =
TMS =
TMS 320
F
2810
PBK
experimental device
prototype device
qualified device
DEVICE FAMILY
320 =
TMS320
DSP Family
TECHNOLOGY
F =
Flash EEPROM (1.8-V Core/3.3-V I/O)
PACKAGE TYPE
GHH = 179-pin MicroStar BGA
PGF = 176-pin LQFP
PBK = 128-pin LQFP
DEVICE
2810
2812
BGA
LQFP =
=
Ball Grid Array
Low-Profile Quad Flatpack
TEMPERATURE RANGE
A
=
–
40
°
C to 85
°
C
S
=
–
40
°
C to 125
°
C
A
Figure 23. TMS320x28x Device Nomenclature
P