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參數(shù)資料
| 型號： | TPS2343DDPG3 |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 電源管理 |
| 英文描述： | 6-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO80 |
| 封裝： | GREEN, PLASTIC, HTSSOP-80 |
| 文件頁數(shù)： | 31/42頁 |
| 文件大?。?/td> | 942K |
| 代理商： | TPS2343DDPG3 |
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PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
TPS2343DDP
ACTIVE
HTSSOP
DDP
80
28
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
TPS2343DDPG3
ACTIVE
HTSSOP
DDP
80
28
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
TPS2343DDPR
ACTIVE
HTSSOP
DDP
80
2000 Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
TPS2343DDPRG3
ACTIVE
HTSSOP
DDP
80
2000 Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
Addendum-Page 1
相關(guān)PDF資料 |
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| TPS2343DDPR | 6-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO80 |
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| TPS2346PWG4 | 4-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO24 |
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| TPS2350PWG4 | 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO14 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TPS2343DDPR | 功能描述:熱插拔功率分布 Dual Slot PCI-X 2.0 Hot-Plug Pwr Cntrlr RoHS:否 制造商:Texas Instruments 產(chǎn)品:Controllers & Switches 電流限制: 電源電壓-最大:7 V 電源電壓-最小:- 0.3 V 工作溫度范圍: 功率耗散: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Tube |
| TPS2343DDPRG3 | 功能描述:熱插拔功率分布 Dual Slot PCI-X 2.0 Hot-Plug Pwr Cntrlr RoHS:否 制造商:Texas Instruments 產(chǎn)品:Controllers & Switches 電流限制: 電源電壓-最大:7 V 電源電壓-最小:- 0.3 V 工作溫度范圍: 功率耗散: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Tube |
| TPS2345PW | 功能描述:IC PWR MGR HOT SWAP 24-TSSOP RoHS:是 類別:集成電路 (IC) >> PMIC - 熱交換 系列:- 產(chǎn)品培訓(xùn)模塊:Obsolescence Mitigation Program 標準包裝:100 系列:- 類型:熱插拔開關(guān) 應(yīng)用:通用 內(nèi)部開關(guān):是 電流限制:可調(diào) 電源電壓:9 V ~ 13.2 V 工作溫度:-40°C ~ 150°C 安裝類型:表面貼裝 封裝/外殼:10-WFDFN 裸露焊盤 供應(yīng)商設(shè)備封裝:10-TDFN-EP（3x3） 包裝:管件 |
| TPS2345PWR | 制造商:Rochester Electronics LLC 功能描述:COMPACTPCI HOT SWAP POWER MANAGER - Bulk |
| TPS2346PW | 功能描述:IC HOT SWAP POWER MGR 24-TSSOP RoHS:是 類別:集成電路 (IC) >> PMIC - 熱交換 系列:- 產(chǎn)品培訓(xùn)模塊:Obsolescence Mitigation Program 標準包裝:100 系列:- 類型:熱插拔開關(guān) 應(yīng)用:通用 內(nèi)部開關(guān):是 電流限制:可調(diào) 電源電壓:9 V ~ 13.2 V 工作溫度:-40°C ~ 150°C 安裝類型:表面貼裝 封裝/外殼:10-WFDFN 裸露焊盤 供應(yīng)商設(shè)備封裝:10-TDFN-EP（3x3） 包裝:管件 |
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