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參數(shù)資料
| 型號： | TPS2343DDPR |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 電源管理 |
| 英文描述： | 6-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO80 |
| 封裝： | GREEN, PLASTIC, HTSSOP-80 |
| 文件頁數(shù)： | 13/42頁 |
| 文件大小： | 942K |
| 代理商： | TPS2343DDPR |
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TPS2343
SLUS644B FEBRUARY 2005 MAY 2005
20
www.ti.com
APPLICATION INFORMATION
Power and Grounding
Connect all TPS2343 grounds directly to the digital ground plane on the circuit board through the shortest path
possible. Also connect P12VINA, P12VINB, M12VINA and M12VINB directly to the appropriate power plane
through the shortest path possible. A 0.1-
F decoupling capacitor is recommended on each of these power pins,
as close to the pin as possible.
Thermal Model
The TPS2343 is packaged in the HTSSOP-80 PowerPad
t small outline package. The PowerPadt package
is a thermally enhanced standard size device package designed to eliminate the use of bulky heatsinks and
slugs traditionally used in thermal packages. This package can be easily mounted using standard printed circuit
board (PCB) assembly techniques, and can be removed and replaced using standard repair procedures.
The leadframe die pad is exposed on the bottom of the device. This provides an extremely low thermal
resistance between the die and the thermal pad. The thermal pad can be soldered directly to the PCB for
heatsinking. In addition, through the use of thermal vias, the thermal pad can be directly connected to a power
plane or special heat sink structure designed into the PCB. On the TPS2343, the die substrate is internally
connected to the 12-V input supply. Therefore the power plane or heatsink connected to the thermal pad on
the bottom of the device must also connect to the 12-V input supply (recommended) or float independent of
any supply (acceptable).
The thermal performance can be modeled by determining the thermal resistance between the die and the
ambient environment. Thermal resistances are measures of how effectively an object dissipates heat. Typically,
the larger the device, the more surface area available for power dissipation and the lower the object’s thermal
resistance. Figure 3 illustrates the thermal path and resistances from the die, TJ through the printed circuit board
to the ambient air.
UDG02156
12 VIN or Floating
Solder
Copper
Trace
Via
Thermal Via
Heatsink/Copper Plane
Die
PD
(Watts)
Die Junction Temperature
Die Case Temperature
PCB Pad Temperature
PCB Heatsink Temperature
Ambient Air Temperature
TJ
qJC
TC
qCP
TP
qPH
TH
qHA
TA
TPS2343 80 HTSSOP PowerPad
t
Figure 2. PowerPAD
t Thermal Model
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