參數(shù)資料
型號: TPS54010PWPG4
廠商: TEXAS INSTRUMENTS INC
元件分類: 穩(wěn)壓器
英文描述: 25 A SWITCHING REGULATOR, 762 kHz SWITCHING FREQ-MAX, PDSO28
封裝: GREEN, PLASTIC, HTSSOP-28
文件頁數(shù): 29/29頁
文件大?。?/td> 984K
代理商: TPS54010PWPG4
www.ti.com
Connect Pin 1 to Analog Ground Plane
in This Area for Optimum Performance
Minimum Recommended Top
Side Analog Ground Area
0.3478
0.0150
0.06
0.0256
0.1700
0.1340
0.0630
0.0400
0.0180
4 PL
0.2090
0.0130
8 PL
Minimum Recommended Exposed
Copper Area for PowerPAD. 5mm
Stencils May Require 10 Percent
Larger Area
0.0650
0.0500
0.0650
0.0339
0.0500
Minimum Recommended Thermal Vias: 8 x 0.013 Diameter Inside
PowerPAD Area 4 x 0.018 Diameter Under Device as Shown.
Additional 0.018 Diameter Vias May Be Used if Top Side Analog Ground
Area Is Extended.
0.3820
TPS54010
SLVS509B – MAY 2004 – REVISED JUNE 2005
tain as much separation as possible while keeping
ted to the largest area available. Additional areas on
the layout compact. Connect the bias capacitor from
the top or bottom layers also help dissipate heat, and
the VBIAS pin to analog ground using the isolated
any area available must be used when 6-A or greater
analog ground trace. If a slow-start capacitor or RT
operation is desired. Connection from the exposed
resistor is used, or if the SYNC pin is used to select
area of the PowerPAD to the analog ground plane
350-kHz operating frequency, connect them to this
layer must be made using 0.013-inch diameter vias to
trace.
avoid solder wicking through the vias.
For operation at full rated load current, the analog
Eight vias must be in the PowerPAD area with four
ground
plane
must
provide
an
adequate
additional vias located under the device package. The
heat-dissipating area. A 3-inch by 3-inch plane of
size of the vias under the package, but not in the
1-ounce copper is recommended, though not manda-
exposed thermal pad area, can be increased to
tory, depending on ambient temperature and airflow.
0.018.
Additional
vias
beyond
the
twelve
rec-
Most applications have larger areas of internal ground
ommended that enhance thermal performance must
plane available, and the PowerPAD must be connec-
be included in areas not under the device package.
Figure 11. Recommended Land Pattern for 28-Pin PWP PowerPAD
9
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