參數(shù)資料
型號(hào): TS8308500CGL
廠商: E2V TECHNOLOGIES PLC
元件分類(lèi): ADC
英文描述: 1-CH 8-BIT PROPRIETARY METHOD ADC, SERIAL ACCESS, CBGA68
封裝: 11 X 11 MM, 1.27MM PITCH, CERAMIC, BGA-68
文件頁(yè)數(shù): 37/50頁(yè)
文件大?。?/td> 491K
代理商: TS8308500CGL
42
TS8308500
2193A–BDC–04/03
Outline Dimensions
Figure 49. Outline Dimensions - 68 Pins CBGA
CBGA 68 package.
AL203 substrate.
Package design.
Corner balls (x4) are not connected (mechanical ball).
Balls : 1.27 mm pitch on 11x11 grid.
Top side with
soldered R, C
devices
(using solder
Sn/Pb 63/37)
Balls side
Balls
Sn/Pb 63/37
AI203 substrate
AI203 Ceramic
Cap. Glued and embedded
in substrate
1.45
± 0.12
0.63
± 0.10
Detail of
ball x2
All units in mm
1.27
View balls side
15.00
± 0.15 mm
0.95 max
15.00
±
0.15
mm
1.27 ref
7.84
AB
C
D
E
F
G
H
J
K
L
1
2
3
4
5
6
7
8
9
10
11
- A -
Ball
A1 Index
other side
68 x
D = 0.80 ± 0.10 mm
0.40
0.15
TA B
T
(Position of array of balls/edges A and B)
(Position of balls within array)
- B -
50
0.20
T
100
pF
- T -
D
0.15
1.00
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