參數(shù)資料
型號: TSC2101IRGZRG4
廠商: TEXAS INSTRUMENTS INC
元件分類: 消費(fèi)家電
英文描述: SPECIALTY CONSUMER CIRCUIT, PQCC48
封裝: GREEN, PLASTIC, VQFN-48
文件頁數(shù): 72/95頁
文件大?。?/td> 1217K
代理商: TSC2101IRGZRG4
TSC2101
SLAS392D JUNE 2003 REVISED MAY 2005
www.ti.com
74
BIT
FUNCTION
READ/
WRITE
RESET
VALUE
NAME
D12
ID
X
R
Data Identification
0 => X or Z1 coordinate or BAT or AUX2 data in R11R0
1 => Y or Z2 coordinate or AUX1 or TEMP data in R11R0
Order for Writing Data in Buffer When Multiple Inputs are Selected
For XY Conversion:
Y, X
For XYZ1Z2 Conversion:
Y, X, Z1, Z2
For Z1Z2 Conversion:
Z1, Z2
For Auto Scan Conversion: AUX1 (if selected), AUX2 (if selected), TEMP (if selected)
For Port Scan Conversion: BAT, AUX1, AUX2
D11D0
R11R0
X’s
R
Converted Data
LAYOUT
The following layout suggestions should provide optimum performance from the TSC2101. However, many
portable applications have conflicting requirements concerning power, cost, size, and weight. In general, most
portable devices have fairly clean power and grounds because most of the internal components are very low
power. This situation would mean less bypassing for the converter’s power and less concern regarding
grounding. Still, each situation is unique and the following suggestions should be reviewed carefully.
For optimum performance, care should be taken with the physical layout of the TSC2101 circuitry. The basic
SAR architecture is sensitive to glitches or sudden changes on the power supply, reference, ground
connections, and digital inputs that occur just prior to latching the output of the analog comparator. Therefore,
during any single conversion for an n-bit SAR converter, there are n windows in which large external transient
voltages can easily affect the conversion result. Such glitches might originate from switching power supplies,
nearby digital logic, and high power devices. The degree of error in the digital output depends on the reference
voltage, layout, and the exact timing of the external event. The error can change if the external event changes
in time with respect to the timing of the critical n windows.
With this in mind, power to the TSC2101 should be clean and well bypassed. A 0.1 F ceramic bypass capacitor
should be placed as close to the device as possible. A 1 F to 10 F capacitor may also be needed if the
impedance of the connection between the TSC2101 supply pins and system power supply is high.
A bypass capacitor on the VREF pin is generally not needed because the reference is buffered by an internal
op amp, although it can be useful to reduce reference noise level. If an external reference voltage originates
from an op amp, make sure that it can drive any bypass capacitor that is used without oscillation.
The TSC2101 architecture offers no inherent rejection of noise or voltage variation in regards to using an
external reference input. This is of particular concern when the reference input is tied to the power supply. Any
noise and ripple from the supply appears directly in the digital results. While high frequency noise can be filtered
out, voltage variation due to line frequency (50 Hz or 60 Hz) can be difficult to remove.
The ground pins should be connected to a clean ground point. In many cases, this is the analog ground. Avoid
connections, which are too near the grounding point of a microcontroller or digital signal processor. If needed,
run a ground trace directly from the converter to the power supply entry or battery connection point. The ideal
layout includes an analog ground plane dedicated to the converter and associated analog circuitry.
In the specific case of use with a resistive touch screen, care should be taken with the connection between the
converter and the touch screen. Since resistive touch screens have fairly low resistance, the interconnection
should be as short and robust as possible. Loose connections can be a source of error when the contact
resistance changes with flexing or vibrations.
As indicated previously, noise can be a major source of error in touch-screen applications (e.g., applications
that require a back-lit LCD panel). This EMI noise can be coupled through the LCD panel to the touch screen
and cause flickering of the converted ADC data. Several things can be done to reduce this error, such as utilizing
a touch screen with a bottomside metal layer connected to ground. This couples the majority of noise to
ground. Additionally, filtering capacitors, from Y+, Y–, X+, and X– to ground, can also help. Note, however, that
the use of these capacitors increases screen settling time and require longer panel voltage stabilization times,
as well as increased precharge and sense times for the PINTDAV circuitry of the TSC2101.
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