參數(shù)資料
型號(hào)： UPD7225GC-AB6
廠商： NEC Corp.
英文描述： PROGRAMMABLE LCD CONTROLLER/DRIVER
中文描述： 可編程LCD控制器/驅(qū)動(dòng)
文件頁(yè)數(shù)： 47/52頁(yè)
文件大?。?/td> 289K
代理商： UPD7225GC-AB6
Data Sheet S14308EJ6V0DS00
47
μ
PD7225
12. RECOMMENDED SOLDERING CONDITIONS
When mounting the
μ
PD7225 by soldering, soldering should be performed under the following recommended
conditions.
Should other than recommended conditions be used, consult with our sales personnel.
Surface Mount Type
μ
PD7225G00
μ
PD7225G01
μ
PD7225GC-AB6
: 52-pin plastic QFP (14
×
14 mm)
: 52-pin plastic QFP (straight) ( 14 mm)
: 52-pin plastic QFP (14
×
14 mm)
Soldering Method
Soldering Condition
Symbol of
Recommended
Soldering Condition
Partial Heating
Pin temperature: 300
°
C MAX., Time: 3 seconds MAX. (Per side of device)
μ
PD7225GB-3B7
: 56-pin plastic QFP (10
×
10 mm)
Soldering Method
Soldering Condition
Symbol of
Recommended
Soldering Condition
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds MAX. (210
°
C MIN.),
Number of times: 3 MAX.
IR35-00-3
VPS
Package peak temperature: 215
°
C, Time: 40 seconds MAX. (200
°
C MIN),
Number of times: 3 MAX.
VP-15-00-3
Wave soldering
Solder bath temperature: 260
°
C MAX., Time: 10 seconds MAX., Number of
times: 1, Preheating temperature: 120
°
C MAX. (Package surface)
WS-60-00-1
Caution
Do not use two or more soldering methods in combination (except the partial heating method).
Reference Documents
NEC Semiconductor Device Reliability / Quality Control System (C10983E)
Quality Grades to NEC’s Semiconductor Devices (C11531E)
Semiconductor Device Mounting Technology Manual (C10535E)
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