參數(shù)資料
型號: UPD75066GBA
廠商: NEC Corp.
英文描述: 4-BIT SINGLE-CHIP MICROCOMPUTER
中文描述: 4位單片機(jī)
文件頁數(shù): 63/68頁
文件大?。?/td> 640K
代理商: UPD75066GBA
63
μ
PD75064, 75066, 75068, 75064(A), 75066(A), 75068(A)
Table 13-2. Soldering Conditions for Through-Hole Type Devices
μ
PD75064CU-
×××
: 42-pin plastic shrink DIP (600 mil)
μ
PD75066CU-
×××
: 42-pin plastic shrink DIP (600 mil)
μ
PD75068CU-
×××
: 42-pin plastic shrink DIP (600 mil)
μ
PD75064CU(A)-
×××
: 42-pin plastic shrink DIP (600 mil)
μ
PD75066CU(A)-
×××
: 42-pin plastic shrink DIP (600 mil)
μ
PD75068CU(A)-
×××
: 42-pin plastic shrink DIP (600 mil)
Soldering method
Wave soldering
(Only leads)
Partial heating
Soldering conditions
Soldering bath temperature : 260
°
C max., Time : 10 seconds max.
Pin temperature : 300
°
C max., Time : 3 seconds max. (per pin)
Caution Solder only the leads by means of wave soldering , and exercise care that the jetted solder does
not come in contact with the package.
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