參數(shù)資料
型號: UPD753036GK
廠商: NEC Corp.
英文描述: DIODE ZENER SINGLE 500mW 75Vz 1.7mA-Izt 0.05 0.1uA-Ir 56Vr DO35-GLASS 5K/REEL
中文描述: 4位單片機(jī)
文件頁數(shù): 75/88頁
文件大?。?/td> 483K
代理商: UPD753036GK
75
μ
PD753036, 753036(A)
Data Sheet U11353EJ4V0DS00
15. RECOMMENDED SOLDERING CONDITIONS
Solder the
μ
PD753036 under the following recommended conditions.
For the details on the recommended soldering conditions, refer to Information Document
Semiconductor
Device Mounting Technology Manual (C10535E)
.
For the soldering methods and conditions other than those recommended, consult NEC.
Table 15-1. Soldering Conditions of Surface Mount Type
(1)
μ
PD753036GC-
×××
-3B9:
μ
PD753036GC(A)-
×××
-3B9: 80-pin plastic QFP (14
×
14 mm, 0.65 mm pitch)
80-pin plastic QFP (14
×
14 mm, 0.65 mm pitch)
Symbol of
Recommended
Condition
Soldering Method
Soldering Conditions
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds max. (210
°
C min.),
Number of times: 3 max.
IR35-00-3
VPS
Package peak temperature: 215
°
C, Time: 40 seconds max. (200
°
C min.),
Number of times: 3 max.
VP15-00-3
Wave soldering
Soldering bath temperature: 260
°
C max., Time: 10 seconds max.,
Number of times: 1
WS60-00-1
Preheating temperature: 120
°
C max. (package surface temperature)
Pin temperature: 300
°
C max., Time: 3 seconds max. (per side of device)
Partial heating
(2)
μ
PD753036GK-
×××
-BE9: 80-pin plastic TQFP (fine pitch) (12
×
12 mm, 0.5 mm pitch)
Symbol of
Recommended
Condition
Soldering Method
Soldering Conditions
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds max. (210
°
C min.),
Number of times: 2 max., Exposure limit: 7 days
Note
(after that, prebake at
125
°
C for 10 hours)
Package peak temperature: 215
°
C, Time: 40 seconds max. (200
°
C min.),
Number of times: 2 max., Exposure limit: 7 days
Note
(after that, prebake at
125
°
C for 10 hours)
Pin temperature: 300
°
C max., Time: 3 seconds max. (per side of device)
IR35-107-2
VPS
VP15-107-2
Partial heating
Note
After opening the dry pack, store it at 25
°
C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
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