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參數(shù)資料
| 型號(hào)： | W72M64V-XBX |
| 英文描述： | Flash MCP |
| 中文描述： | 閃存MCP的 |
| 文件頁(yè)數(shù)： | 13/15頁(yè) |
| 文件大?。?/td> | 160K |
| 代理商： | W72M64V-XBX |
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13
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
W72M64V-X BX
FIG 14:
ALTERNATE CS CONTROLLED WRITE (ERASE/PROGRAM)
OPERATION TIMINGS
NOTES:
1. Figure indicates last two bus cycles of a program or erase operation.
2. PA = program address, SA = sector address, PD = program data.
3. DQ
7
is the complement of the data written to the device. D
OUT
is the data written to the device.
Addresses
555 for Program
2AA for Erase
PA
t
WC
WE
OE
CS
Data
t
AS
t
AH
t
CPH
t
WS
DQ
7
RESET
t
DH
t
DS
PD for Program
30 for Sector Erase
10 for Chip Erase
PA for Program
SA for Sector Erase
555 for Chip Erase
Data Polling
t
WH
t
GHEL
t
WHWH1 OR 2
t
BUSY
t
HR
A0 for Program
55 for Erase
RY/BY
t
CP
D
OUT
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| W72M64VK120BM | 2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package |
| W72M64VK100BC | 2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package |
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相關(guān)代理商/技術(shù)參數(shù) |
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