參數(shù)資料
型號(hào): W78M32VP110BM
廠商: WHITE ELECTRONIC DESIGNS CORP
元件分類(lèi): PROM
英文描述: 8M X 32 FLASH 3.3V PROM, 110 ns, PBGA159
封裝: 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159
文件頁(yè)數(shù): 44/51頁(yè)
文件大小: 1637K
代理商: W78M32VP110BM
49
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
W78M32VP-XBX
January 2010
Rev. 12
White Electronic Designs Corp. reserves the right to change products or specications without notice.
Document Title
8Mx32 Flash 3.3V Page Mode Multi-Chip Package (continued)
Revision History Continued
Rev #
History
Release Date
Status
Rev 4
Change (Pg. 48)
4.14 Change dimension thickness to 2.70 (0.106) max due to
typo
March 2009
Advanced
Rev 5
Change (Pg. 1, 2, 3, 16 ,23, 26, 30, 39, 41, 44)
5.1 Delete VIO range is 1.65 to VCC
5.2 Remove (*) astrisk from pin H10, A-1 from Fig 3, correct
spelling of versatile in Fig. 2
5.3 Delete versatile IO (VIO) control pargraph
5.4 Remove paragraph on customer programming services
5.5 Remove all reference to Fig. 8.1
5.6 Change output hold from address in Table 32 to 0 for both
speeds grades, change output enable hold time - Read to
0 for both speed grades
5.7 Table 38, note 1 is Table 2, note 8 is Table3
5.8 Table 39 note 1 is Table 2
5.9 Correct Fig. 12; Maximum negative overshoot wave form,
Fig. 13; maximum positive overshoot waveform
5.10 Add Table 40; Power-up sequence timings and notes
March 2009
Advanced
Rev 6
Change (Pg. 29)
6.1 Table 37 notes: change notes 1-5
June 2009
Advanced
Rev 7
Change (Pg. 4, 7,25, 26, 27, 28, 29, 30, 39, 40, 41, 43, 45, 46)
7.1 Change Table 38 to 39
7.2 Add new Table 32 - Test Specications
7.3 Re-number table sequence from Table 32
7.4 Add Note #1 to Figure 16
7.5 Remove Table 41, duplicate to Table 35
7.6 Add Note #4 to Figure 21
7.7 Add Note #2 to Figure 24
August 2009
Advanced
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
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