參數(shù)資料
型號: X28C513JIZ-15
廠商: INTERSIL CORP
元件分類: DRAM
英文描述: 5V, Byte Alterable EEPROM
中文描述: 64K X 8 EEPROM 5V, 150 ns, PQCC32
封裝: ROHS COMPLIANT, PLASTIC, MS-016AE, LCC-32
文件頁數(shù): 20/21頁
文件大?。?/td> 473K
代理商: X28C513JIZ-15
20
FN8106.2
June 7, 2006
X28C512, X28C513
Plastic Leaded Chip Carrier Packages (PLCC)
A1
A
SEATING
PLANE
0.015 (0.38)
MIN
VIEW “A”
D2/E2
0.025 (0.64)
0.042 (1.07)
0.056 (1.42)
0.050 (1.27) TP
E
E1
PIN (1)
IDENTIFIER
C
D1
D
0.020 (0.51) MAX
3 PLCS
0.026 (0.66)
0.032 (0.81)
0.050 (1.27)
MIN
0.013 (0.33)
0.021 (0.53)
0.025 (0.64)
MIN
VIEW “A” TYP.
0.004 (0.10)
C
-C-
D2/E2
C
NE
ND
(0.12)
0.005
M
D S
- B S
A S
0.042 (1.07)
0.048 (1.22)
N32.45x55
(JEDEC MS-016AE ISSUE A)
32 LEAD PLASTIC LEADED CHIP CARRIER PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.125
0.140
3.18
3.55
-
A1
0.060
0.095
1.53
2.41
-
D
0.485
0.495
12.32
12.57
-
D1
0.447
0.453
11.36
11.50
3
D2
0.188
0.223
4.78
5.66
4, 5
E
0.585
0.595
14.86
15.11
-
E1
0.547
0.553
13.90
14.04
3
E2
0.238
0.273
6.05
6.93
4, 5
N
28
28
6
ND
7
7
7
NE
9
9
7
Rev. 0 7/98
NOTES:
1. Controlling dimension: INCH. Converted millimeter dimen-
sions are not necessarily exact.
2. Dimensions and tolerancing per ANSI Y14.5M-1982.
3. Dimensions D1 and E1 do not include mold protrusions. Al-
lowable mold protrusion is 0.010 inch (0.25mm) per side.
Dimensions D1 and E1 include mold mismatch and are mea-
sured at the extreme material condition at the body parting
line.
4. To be measured at seating plane
5. Centerline to be determined where center leads exit plastic
body.
6. “N” is the number of terminal positions.
7. ND denotes the number of leads on the two shorts sides of the
package, one of which contains pin #1. NE denotes the num-
ber of leads on the two long sides of the package.
contact point.
-C-
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