參數(shù)資料
型號(hào)： XA3S700A-4FGG400I
廠商： Xilinx Inc
文件頁數(shù)： 2/57頁
文件大?。?/td> 0K
描述： IC FPGA SPARTAN-3A 700K 400-FBGA
產(chǎn)品培訓(xùn)模塊： Extended Spartan 3A FPGA Family
標(biāo)準(zhǔn)包裝： 60
系列： Spartan®-3A XA
LAB/CLB數(shù)： 1472
邏輯元件/單元數(shù)： 13248
RAM 位總計(jì)： 368640
輸入/輸出數(shù)： 311
門數(shù)： 700000
電源電壓： 1.14 V ~ 1.26 V
安裝類型： 表面貼裝
工作溫度： -40°C ~ 100°C
封裝/外殼： 400-BGA
供應(yīng)商設(shè)備封裝： 400-FBGA（21x21）
XA Spartan-3A Automotive FPGA Family Data Sheet
DS681 (v2.0) April 22, 2011
Product Specification
10
Quiescent Current Requirements
Table 10: Quiescent Supply Current Characteristics
Symbol
Description
Device
I-Grade
Maximum(2)
Q-Grade
Maximum(2)
Units
ICCINTQ
Quiescent VCCINT supply current
XA3S200A
7
70
110
mA
XA3S400A
10
125
230
mA
XA3S700A
13
185
330
mA
XA3S1400A
24
310
580
mA
ICCOQ
Quiescent VCCO supply current
XA3S200A
0.2
3
4
mA
XA3S400A
0.3
4
5
mA
XA3S700A
0.3
4
5
mA
XA3S1400A
0.3
4
5
mA
ICCAUXQ
Quiescent VCCAUX supply current
XA3S200A
5
15
20
mA
XA3S400A
5
24
40
mA
XA3S700A
6
34
60
mA
XA3S1400A
10
58
95
mA
Notes:
1.
The numbers in this table are based on the conditions set forth in Table 8.
2.
Quiescent supply current is measured with all I/O drivers in a high-impedance state and with all pull-up/pull-down resistors at the I/O pads
disabled. Typical values are characterized using typical devices at room temperature (TJ of 25°C at VCCINT = 1.2V, VCCO = 3.3V, and VCCAUX
= 2.5V). The maximum limits are tested for each device at the respective maximum specified junction temperature and at maximum voltage
limits with VCCINT = 1.26V, VCCO = 3.6V, and VCCAUX = 3.6V. The FPGA is programmed with a “blank” configuration data file (that is, a design
with no functional elements instantiated). For conditions other than those described above (for example, a design including functional
elements), measured quiescent current levels will be different than the values in the table.
3.
There are two recommended ways to estimate the total power consumption (quiescent plus dynamic) for a specific design: a) The
Spartan-3A FPGA XPower Estimator provides quick, approximate, typical estimates, and does not require a netlist of the design. b) XPower
Analyzer uses a netlist as input to provide maximum estimates as well as more accurate typical estimates.
4.
The maximum numbers in this table indicate the minimum current each power rail requires in order for the FPGA to power-on successfully.
5.
For information on the power-saving Suspend mode, see XAPP480: Using Suspend Mode in Spartan-3 Generation FPGAs. Suspend mode
typically saves 40% total power consumption compared to quiescent current.
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XA3S700A-4FGG400Q 功能描述:IC FPGA SPARTAN-3A 700K 400-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Spartan®-3A XA 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計(jì):2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA（27x27）
XA3S700A-4FGG484I 功能描述:IC FPGA SPARTAN-3A 700K 484-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Spartan®-3A XA 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計(jì):2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA（27x27）
XA3S700A-4FGG484Q 功能描述:IC FPGA SPARTAN-3A 700K 484-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Spartan®-3A XA 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計(jì):2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA（27x27）
XA3SD1800A 制造商:XILINX 制造商全稱:XILINX 功能描述:XA Spartan-3A DSP Automotive FPGA Family Data Sheet
XA3SD1800A-4CSG484I 功能描述:SPARTAN-3ADSP FPGA 1800K 484CSBG RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Spartan®-3A DSP XA 產(chǎn)品變化通告:Step Intro and Pkg Change 11/March/2008 標(biāo)準(zhǔn)包裝:1 系列:Virtex®-5 SXT LAB/CLB數(shù):4080 邏輯元件/單元數(shù):52224 RAM 位總計(jì):4866048 輸入/輸出數(shù):480 門數(shù):- 電源電壓:0.95 V ~ 1.05 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:1136-BBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5
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