參數(shù)資料
型號(hào): XA3S700A-4FGG400I
廠商: Xilinx Inc
文件頁(yè)數(shù): 53/57頁(yè)
文件大?。?/td> 0K
描述: IC FPGA SPARTAN-3A 700K 400-FBGA
產(chǎn)品培訓(xùn)模塊: Extended Spartan 3A FPGA Family
標(biāo)準(zhǔn)包裝: 60
系列: Spartan®-3A XA
LAB/CLB數(shù): 1472
邏輯元件/單元數(shù): 13248
RAM 位總計(jì): 368640
輸入/輸出數(shù): 311
門(mén)數(shù): 700000
電源電壓: 1.14 V ~ 1.26 V
安裝類(lèi)型: 表面貼裝
工作溫度: -40°C ~ 100°C
封裝/外殼: 400-BGA
供應(yīng)商設(shè)備封裝: 400-FBGA(21x21)
XA Spartan-3A Automotive FPGA Family Data Sheet
DS681 (v2.0) April 22, 2011
Product Specification
57
Revision History
The following table shows the revision history for this document.
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Automotive Applications Disclaimer
XILINX PRODUCTS ARE NOT DESIGNED OR INTENDED TO BE FAIL-SAFE, OR FOR USE IN ANY APPLICATION REQUIRING
FAIL-SAFE PERFORMANCE, SUCH AS APPLICATIONS RELATED TO: (I) THE DEPLOYMENT OF AIRBAGS, (II) CONTROL OF A
VEHICLE, UNLESS THERE IS A FAIL-SAFE OR REDUNDANCY FEATURE (WHICH DOES NOT INCLUDE USE OF SOFTWARE IN
THE XILINX DEVICE TO IMPLEMENT THE REDUNDANCY) AND A WARNING SIGNAL UPON FAILURE TO THE OPERATOR, OR (III)
USES THAT COULD LEAD TO DEATH OR PERSONAL INJURY. CUSTOMER ASSUMES THE SOLE RISK AND LIABILITY OF ANY
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Date
Version
Revision
04/30/08
1.0
Initial release.
05/07/08
1.0.1
Updated Figure 14, minor edits under Features and Package Marking, Table 20 and 21.
02/03/09
1.1
Updated Key Feature Differences from Commercial XC Devices, page 2. Removed MultiBoot description
from Configuration, page 3. Updated to v1.41 in Table 3 and Table 16. Removed -5 high performance
(commercial only) speed grade from Ordering Information, page 5. Replaced VICM with VCCAUX in Note 7 of
Table 13. Added versions 1.40 and 1.41 to Table 17. Updated Note 2 in Figure 11. Removed TIOOLP from
Table 23. Updated TIOCKHZ and TIOCKON in Table 24. Updated Table 22 and Table 25. Updated SSO number
for left and right I/O banks of DIFF_SSTL18_II standard in Table 28. Updated TACC requirement in Table 54.
04/22/11
2.0
This revision goes along with XCN11019: Data Sheet Revisions for Xilinx Automotive (XA) Spartan-3A/-3A
DSP FPGA Devices. Added IIK to Table 4. Updated description for VIN in Table 8 including adding Note 4.
Also, added Note 2 to IL in Table 9 to note potential leakage between pins of a differential pair. Updated Notes
5 and 6 in Table 13. Table 20: Updated tags to Note 3. In Table 42, corrected symbols for TDNACLKH and
TDNACLKL. Corrected symbols for TSUSPEND_GTS and TSUSPEND_GWE in Table 43. Revised standard title to:
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
XA3S700A-4FGG400Q 功能描述:IC FPGA SPARTAN-3A 700K 400-FBGA RoHS:是 類(lèi)別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門(mén)陣列) 系列:Spartan®-3A XA 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計(jì):2138112 輸入/輸出數(shù):358 門(mén)數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類(lèi)型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA(27x27)
XA3S700A-4FGG484I 功能描述:IC FPGA SPARTAN-3A 700K 484-FBGA RoHS:是 類(lèi)別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門(mén)陣列) 系列:Spartan®-3A XA 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計(jì):2138112 輸入/輸出數(shù):358 門(mén)數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類(lèi)型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA(27x27)
XA3S700A-4FGG484Q 功能描述:IC FPGA SPARTAN-3A 700K 484-FBGA RoHS:是 類(lèi)別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門(mén)陣列) 系列:Spartan®-3A XA 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計(jì):2138112 輸入/輸出數(shù):358 門(mén)數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類(lèi)型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA(27x27)
XA3SD1800A 制造商:XILINX 制造商全稱(chēng):XILINX 功能描述:XA Spartan-3A DSP Automotive FPGA Family Data Sheet
XA3SD1800A-4CSG484I 功能描述:SPARTAN-3ADSP FPGA 1800K 484CSBG RoHS:是 類(lèi)別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門(mén)陣列) 系列:Spartan®-3A DSP XA 產(chǎn)品變化通告:Step Intro and Pkg Change 11/March/2008 標(biāo)準(zhǔn)包裝:1 系列:Virtex®-5 SXT LAB/CLB數(shù):4080 邏輯元件/單元數(shù):52224 RAM 位總計(jì):4866048 輸入/輸出數(shù):480 門(mén)數(shù):- 電源電壓:0.95 V ~ 1.05 V 安裝類(lèi)型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:1136-BBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5