參數(shù)資料
型號： XC2S50E-6PQG208C
廠商： Xilinx Inc
文件頁數(shù)： 12/108頁
文件大小： 0K
描述： IC SPARTAN-IIE FPGA 50K 208-PQFP
產(chǎn)品變化通告： FPGA Family Discontinuation 18/Apr/2011
標(biāo)準(zhǔn)包裝： 24
系列： Spartan®-IIE
LAB/CLB數(shù)： 384
邏輯元件/單元數(shù)： 1728
RAM 位總計： 32768
輸入/輸出數(shù)： 146
門數(shù)： 50000
電源電壓： 1.71 V ~ 1.89 V
安裝類型： 表面貼裝
工作溫度： 0°C ~ 85°C
封裝/外殼： 208-BFQFP
供應(yīng)商設(shè)備封裝： 208-PQFP（28x28）
其它名稱： 122-1330
DS077-2 (v3.0) August 9, 2013
11
Product Specification
Spartan-IIE FPGA Family: Functional Description
R
— OBSOLETE — OBSOLETE — OBSOLETE — OBSOLETE —
Optional pull-up and pull-down resistors and an optional
weak-keeper circuit are attached to each user I/O pad. Prior
to configuration all outputs not involved in configuration are
forced into their high-impedance state. The pull-down resis-
tors and the weak-keeper circuits are inactive, but inputs
may optionally be pulled up. The activation of pull-up resis-
tors prior to configuration is controlled on a global basis by
the configuration mode pins. If the pull-up resistors are not
activated, all the pins will float. Consequently, external
pull-up or pull-down resistors must be provided on pins
required to be at a well-defined logic level prior to configura-
tion.
All pads are protected against damage from electrostatic
discharge (ESD) and from over-voltage transients. After
configuration, clamping diodes are connected to VCCO for
LVTTL, PCI, HSTL, SSTL, CTT, and AGP standards.
All Spartan-IIE FPGA IOBs support IEEE 1149.1-compati-
ble boundary scan testing.
Input Path
A buffer in the IOB input path routes the input signal directly
to internal logic and through an optional input flip-flop.
An optional delay element at the D-input of this flip-flop elim-
inates pad-to-pad hold time. The delay is matched to the
internal clock-distribution delay of the FPGA, and when
used, assures that the pad-to-pad hold time is zero.
Each input buffer can be configured to conform to any of the
low-voltage signaling standards supported. In some of
these standards the input buffer utilizes a user-supplied
threshold voltage, VREF. The need to supply VREF imposes
constraints on which standards can used in close proximity
to each other. See I/O Banking.
There are optional pull-up and pull-down resistors at each
input for use after configuration.
Output Path
The output path includes a 3-state output buffer that drives
the output signal onto the pad. The output signal can be
routed to the buffer directly from the internal logic or through
an optional IOB output flip-flop.
The 3-state control of the output can also be routed directly
from the internal logic or through a flip-flip that provides syn-
chronous enable and disable.
Each output driver can be individually programmed for a
wide range of low-voltage signaling standards. Each output
buffer can source up to 24 mA and sink up to 48 mA. Drive
strength and slew rate controls minimize bus transients. The
default output driver is LVTTL with 12 mA drive strength and
slow slew rate.
In most signaling standards, the output high voltage
depends on an externally supplied VCCO voltage. The need
to supply VCCO imposes constraints on which standards
can be used in close proximity to each other. See I/O Bank-
An optional weak-keeper circuit is connected to each out-
put. When selected, the circuit monitors the voltage on the
pad and weakly drives the pin High or Low to match the
input signal. If the pin is connected to a multiple-source sig-
nal, the weak keeper holds the signal in its last state if all
drivers are disabled. Maintaining a valid logic level in this
way helps eliminate bus chatter.
Because the weak-keeper circuit uses the IOB input buffer
to monitor the input level, an appropriate VREF voltage must
be provided if the signaling standard requires one. The pro-
vision of this voltage must comply with the I/O banking
rules.
I/O Banking
Some of the I/O standards described above require VCCO
and/or VREF voltages. These voltages are externally sup-
plied and connected to device pins that serve groups of
IOBs, called banks. Consequently, restrictions exist about
which I/O standards can be combined within a given bank.
Eight I/O banks result from separating each edge of the
FPGA into two banks (see Figure 5). The pinout tables
show the bank affiliation of each I/O (see Pinout Tables,
page 53). Each bank has multiple VCCO pins which must be
connected to the same voltage. Voltage requirements are
determined by the output standards in use.
In the TQ144 and PQ208 packages, the eight banks have
VCCO connected together. Thus, only one VCCO level is
allowed in these packages, although different VREF values
are allowed in each of the eight banks.
Within a bank, standards may be mixed only if they use the
same VCCO. Compatible standards are shown in Table 4.
GTL and GTL+ appear under all voltages because their
open-drain outputs do not depend on VCCO. Note that VCCO
Figure 5: Spartan-IIE I/O Banks
DS077-2_02_051501
Bank 0
GCLK3
GCLK2
GCLK1
GCLK0
Bank 1
Bank 5
Bank 4
Spartan-IIE
Device
Bank
7
Bank
6
Bank
2
Bank
3
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
XC2S50E-6PQG208I 制造商:XILINX 制造商全稱:XILINX 功能描述:Spartan-IIE FPGA
XC2S50E-6TQ144C 功能描述:IC FPGA 1.8V 384 CLB'S 144-TQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Spartan®-IIE 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA（27x27）
XC2S50E-6TQ144I 制造商:Xilinx 功能描述:IC SYSTEM GATE
XC2S50E-6TQ144Q 制造商:Rochester Electronics LLC 功能描述: 制造商:Xilinx 功能描述:
XC2S50E-6TQG144C 功能描述:IC SPARTAN-IIE FPGA 50K 144-TQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Spartan®-IIE 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA（27x27）
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