參數(shù)資料
型號(hào): XC3S5000-4FGG676I
廠商: Xilinx Inc
文件頁數(shù): 193/272頁
文件大小: 0K
描述: SPARTAN-3A FPGA 5M STD 676-FBGA
產(chǎn)品培訓(xùn)模塊: Extended Spartan 3A FPGA Family
標(biāo)準(zhǔn)包裝: 40
系列: Spartan®-3
LAB/CLB數(shù): 8320
邏輯元件/單元數(shù): 74880
RAM 位總計(jì): 1916928
輸入/輸出數(shù): 489
門數(shù): 5000000
電源電壓: 1.14 V ~ 1.26 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 100°C
封裝/外殼: 676-BGA
供應(yīng)商設(shè)備封裝: 676-FBGA(27x27)
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Spartan-3 FPGA Family: Pinout Descriptions
DS099 (v3.1) June 27, 2013
Product Specification
272
Notice of Disclaimer
THE XILINX HARDWARE FPGA AND CPLD DEVICES REFERRED TO HEREIN (“PRODUCTS”) ARE SUBJECT TO THE TERMS AND
CONDITIONS OF THE XILINX LIMITED WARRANTY WHICH CAN BE VIEWED AT http://www.xilinx.com/warranty.htm. THIS LIMITED
WARRANTY DOES NOT EXTEND TO ANY USE OF PRODUCTS IN AN APPLICATION OR ENVIRONMENT THAT IS NOT WITHIN THE
SPECIFICATIONS STATED IN THE XILINX DATA SHEET. ALL SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE.
PRODUCTS ARE NOT DESIGNED OR INTENDED TO BE FAIL-SAFE OR FOR USE IN ANY APPLICATION REQUIRING FAIL-SAFE
PERFORMANCE, SUCH AS LIFE-SUPPORT OR SAFETY DEVICES OR SYSTEMS, OR ANY OTHER APPLICATION THAT INVOKES
THE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). USE OF PRODUCTS IN CRITICAL APPLICATIONS IS AT THE SOLE RISK OF CUSTOMER, SUBJECT TO
APPLICABLE LAWS AND REGULATIONS.
CRITICAL APPLICATIONS DISCLAIMER
XILINX PRODUCTS (INCLUDING HARDWARE, SOFTWARE AND/OR IP CORES) ARE NOT DESIGNED OR INTENDED TO BE
FAIL-SAFE, OR FOR USE IN ANY APPLICATION REQUIRING FAIL-SAFE PERFORMANCE, SUCH AS IN LIFE-SUPPORT OR
SAFETY DEVICES OR SYSTEMS, CLASS III MEDICAL DEVICES, NUCLEAR FACILITIES, APPLICATIONS RELATED TO THE
DEPLOYMENT OF AIRBAGS, OR ANY OTHER APPLICATIONS THAT COULD LEAD TO DEATH, PERSONAL INJURY OR SEVERE
PROPERTY OR ENVIRONMENTAL DAMAGE (INDIVIDUALLY AND COLLECTIVELY, “CRITICAL APPLICATIONS”). FURTHERMORE,
XILINX PRODUCTS ARE NOT DESIGNED OR INTENDED FOR USE IN ANY APPLICATIONS THAT AFFECT CONTROL OF A
VEHICLE OR AIRCRAFT, UNLESS THERE IS A FAIL-SAFE OR REDUNDANCY FEATURE (WHICH DOES NOT INCLUDE USE OF
SOFTWARE IN THE XILINX DEVICE TO IMPLEMENT THE REDUNDANCY) AND A WARNING SIGNAL UPON FAILURE TO THE
OPERATOR. CUSTOMER AGREES, PRIOR TO USING OR DISTRIBUTING ANY SYSTEMS THAT INCORPORATE XILINX
PRODUCTS, TO THOROUGHLY TEST THE SAME FOR SAFETY PURPOSES. TO THE MAXIMUM EXTENT PERMITTED BY
APPLICABLE LAW, CUSTOMER ASSUMES THE SOLE RISK AND LIABILITY OF ANY USE OF XILINX PRODUCTS IN CRITICAL
APPLICATIONS.
AUTOMOTIVE APPLICATIONS DISCLAIMER
XILINX PRODUCTS ARE NOT DESIGNED OR INTENDED TO BE FAIL-SAFE, OR FOR USE IN ANY APPLICATION REQUIRING
FAIL-SAFE PERFORMANCE, SUCH AS APPLICATIONS RELATED TO: (I) THE DEPLOYMENT OF AIRBAGS, (II) CONTROL OF A
VEHICLE, UNLESS THERE IS A FAIL-SAFE OR REDUNDANCY FEATURE (WHICH DOES NOT INCLUDE USE OF SOFTWARE IN
THE XILINX DEVICE TO IMPLEMENT THE REDUNDANCY) AND A WARNING SIGNAL UPON FAILURE TO THE OPERATOR, OR (III)
USES THAT COULD LEAD TO DEATH OR PERSONAL INJURY. CUSTOMER ASSUMES THE SOLE RISK AND LIABILITY OF ANY
USE OF XILINX PRODUCTS IN SUCH APPLICATIONS.
11/30/2007
2.3
Added XC3S5000 FG(G)676 package. Noted that the FG(G)1156 package is being discontinued.
Updated Table 86 with latest thermal characteristics data.
06/25/2008
2.4
Updated formatting and links.
12/04/2009
2.5
Added link to UG332 in CCLK: Configuration Clock. Noted that the CP132, CPG132, FG1156, and
FGG1156 packages are being discontinued in Table 81, Table 83, Table 84, Table 85, and Table 86.
Updated CP132: 132-Ball Chip-Scale Package to indicate that the CP132 and CPG132 packages are
being discontinued.
10/29/2012
3.0
Added Notice of Disclaimer. Per XCN07022, updated the FG1156 and FGG1156 package discussion
throughout document including in Table 81, Table 83, Table 84, Table 85, and Table 86. Per XCN08011,
updated CP132 and CPG132 package discussion throughout document including in Table 81, Table 83,
Table 84, Table 85, and Table 86. This product is not recommended for new designs.
06/27/2013
3.1
Removed banner. This product IS recommended for new designs.
Date
Version
Description
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
XC3S5000-4FGG900C 功能描述:SPARTAN-3A FPGA 5M STD 900-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:Spartan®-3 產(chǎn)品變化通告:Step Intro and Pkg Change 11/March/2008 標(biāo)準(zhǔn)包裝:1 系列:Virtex®-5 SXT LAB/CLB數(shù):4080 邏輯元件/單元數(shù):52224 RAM 位總計(jì):4866048 輸入/輸出數(shù):480 門數(shù):- 電源電壓:0.95 V ~ 1.05 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:1136-BBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5
XC3S5000-4FGG900I 功能描述:SPARTAN-3A FPGA 5M STD 900-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:Spartan®-3 產(chǎn)品變化通告:Step Intro and Pkg Change 11/March/2008 標(biāo)準(zhǔn)包裝:1 系列:Virtex®-5 SXT LAB/CLB數(shù):4080 邏輯元件/單元數(shù):52224 RAM 位總計(jì):4866048 輸入/輸出數(shù):480 門數(shù):- 電源電壓:0.95 V ~ 1.05 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:1136-BBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5
XC3S5000-5FG1156C 制造商:Xilinx 功能描述:
XC3S5000-5FG676C 制造商:Xilinx 功能描述:FPGA SPARTAN-3 5M GATES 74880 CELLS 725MHZ 1.2V 676FBGA - Trays
XC3S5000-5FG900C 制造商:Xilinx 功能描述:FPGA SPARTAN-3 5M GATES 74880 CELLS 725MHZ 1.2V 900FBGA - Trays