參數(shù)資料
型號(hào)： XC3S50AN-4FTG256I
廠商： Xilinx Inc
文件頁數(shù)： 96/123頁
文件大?。?/td> 0K
描述： IC FPGA SPARTAN-3AN 256FTBGA
標(biāo)準(zhǔn)包裝： 90
系列： Spartan®-3AN
LAB/CLB數(shù)： 176
邏輯元件/單元數(shù)： 1584
RAM 位總計(jì)： 55296
輸入/輸出數(shù)： 195
門數(shù)： 50000
電源電壓： 1.14 V ~ 1.26 V
安裝類型： 表面貼裝
工作溫度： -40°C ~ 100°C
封裝/外殼： 256-LBGA
供應(yīng)商設(shè)備封裝： 256-FTBGA
Spartan-3AN FPGA Family: Pinout Descriptions
DS557 (v4.1) April 1, 2011
Product Specification
74
Mechanical Drawings
Detailed mechanical drawings for each package type are available from the Xilinx website at the specified location in
Material Declaration Data Sheets (MDDS) are also available on the Xilinx website for each package.
Package Thermal Characteristics
The power dissipated by an FPGA application has implications on package selection and system design. The power
consumed by a Spartan-3AN FPGA is reported using either the XPower Power Estimator or the XPower Analyzer calculator
integrated in the Xilinx ISE development software. Table 67 provides the thermal characteristics for the various
Spartan-3AN FPGA packages. This information is also available using the Thermal Query tool at
The junction-to-case thermal resistance (
JC) indicates the difference between the temperature measured on the package
body (case) and the junction temperature per watt of power consumption. The junction-to-board (
JB) value similarly reports
the difference between the board and junction temperature. The junction-to-ambient (
JA) value reports the temperature
difference between the ambient environment and the junction temperature. The
JA value is reported at different air
velocities, measured in linear feet per minute (LFM). The “Still Air (0 LFM)” column shows the
JA value in a system without
a fan. The thermal resistance drops with increasing air flow.
Table 66: Xilinx Package Documentation
Package
Drawing
MDDS
TQ144
TQG144
FT256
FTG256
FG400
FGG400
FG484
FGG484
FG676
FGG676
Table 67: Spartan-3AN FPGA Package Thermal Characteristics
Device
Package(1)
Junction-to-Case
(
JC)
Junction-to-Board
(
JB)
Junction-to-Ambient (
JA)
at Different Air Flows
Units
Still Air
(0 LFM)
250 LFM
500 LFM
750 LFM
XC3S50AN
TQG144
13.4
32.8
38.9
32.8
32.5
31.7
°C/Watt
FTG256
°C/Watt
XC3S200AN
FTG256
7.4
23.3
29.0
23.8
23.0
22.3
°C/Watt
XC3S400AN
FTG256
°C/Watt
FGG400
6.2
12.9
22.5
16.7
15.6
15.0
°C/Watt
XC3S700AN
FGG484
5.3
11.5
19.4
15.0
13.9
13.4
°C/Watt
XC3S1400AN
FGG484
°C/Watt
FGG676
4.3
10.9
17.7
13.7
12.6
12.1
°C/Watt
Notes:
1.
Thermal characteristics are similar for leaded (non-Pb-free) packages.
2.
Use the Thermal Query tool at http://www.xilinx.com/cgi-bin/thermal/thermal.pl for specific device information.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
XC3S50AN-4TQ144I 功能描述:IC FPGA SPARTAN 3AN 144TQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:Spartan®-3AN 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計(jì):2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA（27x27）
XC3S50AN-4TQG144C 功能描述:IC SPARTAN-3AN FPGA 50K 144TQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:Spartan®-3AN 標(biāo)準(zhǔn)包裝:60 系列:XP LAB/CLB數(shù):- 邏輯元件/單元數(shù):10000 RAM 位總計(jì):221184 輸入/輸出數(shù):244 門數(shù):- 電源電壓:1.71 V ~ 3.465 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:388-BBGA 供應(yīng)商設(shè)備封裝:388-FPBGA（23x23） 其它名稱:220-1241
XC3S50AN-4TQG144CES 制造商:Xilinx 功能描述:
XC3S50AN-4TQG144I 功能描述:IC FPGA SPARTAN-3AN50K 144-TQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:Spartan®-3AN 標(biāo)準(zhǔn)包裝:60 系列:XP LAB/CLB數(shù):- 邏輯元件/單元數(shù):10000 RAM 位總計(jì):221184 輸入/輸出數(shù):244 門數(shù):- 電源電壓:1.71 V ~ 3.465 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:388-BBGA 供應(yīng)商設(shè)備封裝:388-FPBGA（23x23） 其它名稱:220-1241
XC3S50AN-4TQG144ICES 制造商:Xilinx 功能描述:
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