參數(shù)資料
型號： XC3S50AN-4FTG256I
廠商： Xilinx Inc
文件頁數(shù)： 13/123頁
文件大小： 0K
描述： IC FPGA SPARTAN-3AN 256FTBGA
標(biāo)準(zhǔn)包裝： 90
系列： Spartan®-3AN
LAB/CLB數(shù)： 176
邏輯元件/單元數(shù)： 1584
RAM 位總計： 55296
輸入/輸出數(shù)： 195
門數(shù)： 50000
電源電壓： 1.14 V ~ 1.26 V
安裝類型： 表面貼裝
工作溫度： -40°C ~ 100°C
封裝/外殼： 256-LBGA
供應(yīng)商設(shè)備封裝： 256-FTBGA
Spartan-3AN FPGA Family: Functional Description
DS557 (v4.1) April 1, 2011
Product Specification
11
Related Product Families
The Spartan-3AN FPGA family is generally compatible with the Spartan-3A FPGA family.
DS529: Spartan-3A FPGA Family Data Sheet
Revision History
The following table shows the revision history for this document.
Notice of Disclaimer
THE XILINX HARDWARE FPGA AND CPLD DEVICES REFERRED TO HEREIN (“PRODUCTS”) ARE SUBJECT TO THE TERMS AND
CONDITIONS OF THE XILINX LIMITED WARRANTY WHICH CAN BE VIEWED AT http://www.xilinx.com/warranty.htm. THIS LIMITED
WARRANTY DOES NOT EXTEND TO ANY USE OF PRODUCTS IN AN APPLICATION OR ENVIRONMENT THAT IS NOT WITHIN THE
SPECIFICATIONS STATED IN THE XILINX DATA SHEET. ALL SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE.
PRODUCTS ARE NOT DESIGNED OR INTENDED TO BE FAIL-SAFE OR FOR USE IN ANY APPLICATION REQUIRING FAIL-SAFE
PERFORMANCE, SUCH AS LIFE-SUPPORT OR SAFETY DEVICES OR SYSTEMS, OR ANY OTHER APPLICATION THAT INVOKES
THE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). USE OF PRODUCTS IN CRITICAL APPLICATIONS IS AT THE SOLE RISK OF CUSTOMER, SUBJECT TO
APPLICABLE LAWS AND REGULATIONS.
CRITICAL APPLICATIONS DISCLAIMER
XILINX PRODUCTS (INCLUDING HARDWARE, SOFTWARE AND/OR IP CORES) ARE NOT DESIGNED OR INTENDED TO BE
FAIL-SAFE, OR FOR USE IN ANY APPLICATION REQUIRING FAIL-SAFE PERFORMANCE, SUCH AS IN LIFE-SUPPORT OR
SAFETY DEVICES OR SYSTEMS, CLASS III MEDICAL DEVICES, NUCLEAR FACILITIES, APPLICATIONS RELATED TO THE
DEPLOYMENT OF AIRBAGS, OR ANY OTHER APPLICATIONS THAT COULD LEAD TO DEATH, PERSONAL INJURY OR SEVERE
PROPERTY OR ENVIRONMENTAL DAMAGE (INDIVIDUALLY AND COLLECTIVELY, “CRITICAL APPLICATIONS”). FURTHERMORE,
XILINX PRODUCTS ARE NOT DESIGNED OR INTENDED FOR USE IN ANY APPLICATIONS THAT AFFECT CONTROL OF A
VEHICLE OR AIRCRAFT, UNLESS THERE IS A FAIL-SAFE OR REDUNDANCY FEATURE (WHICH DOES NOT INCLUDE USE OF
SOFTWARE IN THE XILINX DEVICE TO IMPLEMENT THE REDUNDANCY) AND A WARNING SIGNAL UPON FAILURE TO THE
OPERATOR. CUSTOMER AGREES, PRIOR TO USING OR DISTRIBUTING ANY SYSTEMS THAT INCORPORATE XILINX
PRODUCTS, TO THOROUGHLY TEST THE SAME FOR SAFETY PURPOSES. TO THE MAXIMUM EXTENT PERMITTED BY
APPLICABLE LAW, CUSTOMER ASSUMES THE SOLE RISK AND LIABILITY OF ANY USE OF XILINX PRODUCTS IN CRITICAL
APPLICATIONS.
AUTOMOTIVE APPLICATIONS DISCLAIMER
XILINX PRODUCTS ARE NOT DESIGNED OR INTENDED TO BE FAIL-SAFE, OR FOR USE IN ANY APPLICATION REQUIRING
FAIL-SAFE PERFORMANCE, SUCH AS APPLICATIONS RELATED TO: (I) THE DEPLOYMENT OF AIRBAGS, (II) CONTROL OF A
VEHICLE, UNLESS THERE IS A FAIL-SAFE OR REDUNDANCY FEATURE (WHICH DOES NOT INCLUDE USE OF SOFTWARE IN
THE XILINX DEVICE TO IMPLEMENT THE REDUNDANCY) AND A WARNING SIGNAL UPON FAILURE TO THE OPERATOR, OR (III)
USES THAT COULD LEAD TO DEATH OR PERSONAL INJURY. CUSTOMER ASSUMES THE SOLE RISK AND LIABILITY OF ANY
USE OF XILINX PRODUCTS IN SUCH APPLICATIONS.
Date
Version
Revision
02/26/07
1.0
Initial release.
08/16/07
2.0
Updated for Production release of initial device.
09/12/07
2.0.1
Minor updates to text.
09/24/07
2.1
Added note that In-System Flash commands were not supported by simulation until ISE 10.1 software.
12/12/07
3.0
Updated to Production status with Production release of final family member, XC3S50AN. Noted that
SPI_ACCESS simulation is supported in ISE 10.1 software. Updated links.
06/02/08
3.1
Minor updates.
11/19/09
3.2
In the Spartan-3AN FPGA Design Documentation section, added link to DS706, Extended Spartan-3A
Family Overview and removed references to older software versions.
12/02/10
4.0
Updated link to sign up for Alerts and updated Notice of Disclaimer.
04/01/11
4.1
Added the FT(G)256 package selection for the XC3S50AN and XC3S400AN devices and the
FG(G)484 package selection for the XC3S1400AN device throughout this data sheet.
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參數(shù)描述
XC3S50AN-4TQ144I 功能描述:IC FPGA SPARTAN 3AN 144TQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Spartan®-3AN 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA（27x27）
XC3S50AN-4TQG144C 功能描述:IC SPARTAN-3AN FPGA 50K 144TQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Spartan®-3AN 標(biāo)準(zhǔn)包裝:60 系列:XP LAB/CLB數(shù):- 邏輯元件/單元數(shù):10000 RAM 位總計:221184 輸入/輸出數(shù):244 門數(shù):- 電源電壓:1.71 V ~ 3.465 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:388-BBGA 供應(yīng)商設(shè)備封裝:388-FPBGA（23x23） 其它名稱:220-1241
XC3S50AN-4TQG144CES 制造商:Xilinx 功能描述:
XC3S50AN-4TQG144I 功能描述:IC FPGA SPARTAN-3AN50K 144-TQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Spartan®-3AN 標(biāo)準(zhǔn)包裝:60 系列:XP LAB/CLB數(shù):- 邏輯元件/單元數(shù):10000 RAM 位總計:221184 輸入/輸出數(shù):244 門數(shù):- 電源電壓:1.71 V ~ 3.465 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:388-BBGA 供應(yīng)商設(shè)備封裝:388-FPBGA（23x23） 其它名稱:220-1241
XC3S50AN-4TQG144ICES 制造商:Xilinx 功能描述:
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