參數(shù)資料
型號(hào): 1200
廠商: TEXAS INSTRUMENTS INC
元件分類: 無繩電話/電話
英文描述: TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC20
封裝: 4 X 4 MM, ROHS COMPLIANT, QLP-20
文件頁數(shù): 61/70頁
文件大?。?/td> 841K
代理商: 1200
Chipcon
SmartRF CC1100
Chipcon AS
SmartRF
CC1100 Preliminary Data Sheet (rev. 1.0) 2005-04-25
Page 64 of 68
38.1
Recommended PCB layout for package (QLP 20)
Figure 18: Recommended PCB layout for QLP 20 package
Note: The figure is an illustration only and not to scale. There are 14 mil diameter via holes
distributed symmetrically in the ground pad under the package. See also the CC1100EM
reference design.
38.2
Package thermal properties
Thermal resistance
Air velocity [m/s]
0
Rth,j-a [K/W]
TBD
Table 33: Thermal properties of QLP 20 package
38.3
Soldering information
The recommendations for lead-free reflow in IPC/JEDEC J-STD-020C should be followed.
相關(guān)PDF資料
PDF描述
1200 TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT
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