參數(shù)資料
型號: 25AA040A
廠商: Microchip Technology Inc.
英文描述: 4K SPI Bus Serial EEPROM
中文描述: 4K的SPI總線串行EEPROM
文件頁數(shù): 16/28頁
文件大?。?/td> 447K
代理商: 25AA040A
25AA040A/25LC040A
DS21827D-page 16
2007 Microchip Technology Inc.
8-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
INCHES
NOM
8
.100 BSC
.130
.310
.250
.365
.130
.010
.060
.018
Dimension Limits
MIN
MAX
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
N
e
A
A2
A1
E
E1
D
L
c
b1
b
eB
.210
.195
.325
.280
.400
.150
.015
.070
.022
.430
.115
.015
.290
.240
.348
.115
.008
.040
.014
N
E1
NOTE 1
D
1
2
3
A
A1
A2
L
b1
b
e
E
e
B
c
Microchip Technology Drawing C04-018B
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
25AA040A/S16K 制造商:Microchip Technology Inc 功能描述:4K, 512 X 8, 1.8V SER EE, DIE - Gel-pak, waffle pack, wafer, diced wafer on film
25AA040A/W16K 制造商:Microchip Technology Inc 功能描述:4K, 512 X 8, 1.8V SER EE, WAFER - Gel-pak, waffle pack, wafer, diced wafer on film
25AA040A/WF16K 制造商:Microchip Technology Inc 功能描述:4K, 512 X 8, 1.8V SER EE, WAF - Gel-pak, waffle pack, wafer, diced wafer on film
25AA040A_09 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:4K SPI Bus Serial EEPROM
25AA040A_12 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:4K SPI Bus Serial EEPROM