參數(shù)資料
型號: 25AA040A
廠商: Microchip Technology Inc.
英文描述: 4K SPI Bus Serial EEPROM
中文描述: 4K的SPI總線串行EEPROM
文件頁數(shù): 19/28頁
文件大?。?/td> 447K
代理商: 25AA040A
2007 Microchip Technology Inc.
DS21827D-page 19
25AA040A/25LC040A
8-Lead Plastic Micro Small Outline Package (MS) [MSOP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
MILLIMETERS
NOM
8
0.65 BSC
0.85
4.90 BSC
3.00 BSC
3.00 BSC
0.60
0.95 REF
Dimension Limits
MIN
MAX
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
N
e
A
A2
A1
E
E1
D
L
L1
φ
c
b
1.10
0.95
0.15
0.75
0.00
0.40
0.80
0.08
0.22
0.23
0.40
D
N
E
E1
NOTE 1
1
2
e
b
A
A1
A2
c
L1
L
φ
Microchip Technology Drawing C04-111B
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
25AA040A/S16K 制造商:Microchip Technology Inc 功能描述:4K, 512 X 8, 1.8V SER EE, DIE - Gel-pak, waffle pack, wafer, diced wafer on film
25AA040A/W16K 制造商:Microchip Technology Inc 功能描述:4K, 512 X 8, 1.8V SER EE, WAFER - Gel-pak, waffle pack, wafer, diced wafer on film
25AA040A/WF16K 制造商:Microchip Technology Inc 功能描述:4K, 512 X 8, 1.8V SER EE, WAF - Gel-pak, waffle pack, wafer, diced wafer on film
25AA040A_09 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:4K SPI Bus Serial EEPROM
25AA040A_12 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:4K SPI Bus Serial EEPROM