參數(shù)資料
型號(hào)： 25AA040A
廠商： Microchip Technology Inc.
英文描述： 4K SPI Bus Serial EEPROM
中文描述： 4K的SPI總線串行EEPROM
文件頁(yè)數(shù)： 20/28頁(yè)
文件大小： 447K
代理商： 25AA040A
25AA040A/25LC040A
DS21827D-page 20
2007 Microchip Technology Inc.
8-Lead Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Package is saw singulated.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
MILLIMETERS
NOM
8
0.50 BSC
0.90
0.02
0.20 REF
2.00 BSC
3.00 BSC
–
–
0.25
0.40
–
Dimension Limits
MIN
MAX
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Length
Overall Width
Exposed Pad Length
Exposed Pad Width
Contact Width
Contact Length
Contact-to-Exposed Pad
N
e
A
A1
A3
D
E
D2
E2
b
L
K
0.80
0.00
1.00
0.05
1.30
1.50
0.18
0.30
0.20
1.75
1.90
0.30
0.50
–
D
N
E
NOTE 1
1
2
EXPOSED PAD
NOTE 1
2
1
D2
K
L
E2
N
e
b
A
3
A1
A
NOTE 2
BOTTOM VIEW
TOP VIEW
Microchip Technology Drawing C04-123B
相關(guān)PDF資料
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25AA128 128K SPI Bus Serial EEPROM
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
25AA040A/S16K 制造商:Microchip Technology Inc 功能描述:4K, 512 X 8, 1.8V SER EE, DIE - Gel-pak, waffle pack, wafer, diced wafer on film
25AA040A/W16K 制造商:Microchip Technology Inc 功能描述:4K, 512 X 8, 1.8V SER EE, WAFER - Gel-pak, waffle pack, wafer, diced wafer on film
25AA040A/WF16K 制造商:Microchip Technology Inc 功能描述:4K, 512 X 8, 1.8V SER EE, WAF - Gel-pak, waffle pack, wafer, diced wafer on film
25AA040A_09 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:4K SPI Bus Serial EEPROM
25AA040A_12 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:4K SPI Bus Serial EEPROM
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