參數(shù)資料
型號: 25AA040A
廠商: Microchip Technology Inc.
英文描述: 4K SPI Bus Serial EEPROM
中文描述: 4K的SPI總線串行EEPROM
文件頁數(shù): 17/28頁
文件大小: 447K
代理商: 25AA040A
2007 Microchip Technology Inc.
DS21827D-page 17
25AA040A/25LC040A
8-Lead Plastic Small Outline (SN) – Narrow, 3.90 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
MILLIMETERS
NOM
8
1.27 BSC
6.00 BSC
3.90 BSC
4.90 BSC
1.04 REF
Dimension Limits
MIN
MAX
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
§
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
N
e
A
A2
A1
E
E1
D
h
L
L1
φ
c
b
α
β
1.75
0.25
1.25
0.10
0.25
0.40
0.50
1.27
0.17
0.31
0.25
0.51
15°
15°
D
N
e
E
E1
NOTE 1
1
2
3
b
A
A1
A2
L
L1
c
h
h
φ
β
α
Microchip Technology Drawing C04-057B
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
25AA040A/S16K 制造商:Microchip Technology Inc 功能描述:4K, 512 X 8, 1.8V SER EE, DIE - Gel-pak, waffle pack, wafer, diced wafer on film
25AA040A/W16K 制造商:Microchip Technology Inc 功能描述:4K, 512 X 8, 1.8V SER EE, WAFER - Gel-pak, waffle pack, wafer, diced wafer on film
25AA040A/WF16K 制造商:Microchip Technology Inc 功能描述:4K, 512 X 8, 1.8V SER EE, WAF - Gel-pak, waffle pack, wafer, diced wafer on film
25AA040A_09 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:4K SPI Bus Serial EEPROM
25AA040A_12 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:4K SPI Bus Serial EEPROM