參數(shù)資料
型號(hào): 28F320B3
廠商: Intel Corp.
英文描述: SMART 3 ADVANCED BOOT BLOCK 4-, 8-, 16-, 32-MBIT FLASH MEMORY FAMILY
中文描述: 智能高級(jí)啟動(dòng)3座4 - ,8 - ,16 - ,32 - Mbit閃存家庭
文件頁(yè)數(shù): 10/82頁(yè)
文件大?。?/td> 749K
代理商: 28F320B3
28F6408W30, 28F3204W30, 28F320W30, 28F640W30
4
Preliminary
NOTE:
1. All balls will be populated; however, addresses A
21
and A
22
will be NC.
Figure 2. 56-Ball Matrix, 0.75 mm Ball Pitch, VF BGA Package
and μBGA* Package for the 32-
Mbit and 64-Mbit Discrete Devices
A
B
C
D
E
F
G
A
11
A
8
v
SS
v
CC
v
PP
A
18
A
6
A
4
A
12
A
9
A
20
CLK
RST#
A
17
A
5
A
3
A
13
A
10
ADV#
WE#
A
19
A
7
A
2
A
15
A
14
WAIT
A
16
D
12
WP#
A
1
V
CCQ
D
15
D
6
D
4
D
2
D
1
CE#
A
0
V
SS
D
14
D
13
D
11
D
10
D
9
D
0
OE#
D
7
V
SSQ
D
5
v
CC
D
3
V
CCQ
D
8
V
SSQ
A
4
A
6
A
18
v
PP
v
CC
V
SS
A
8
A
11
A
3
A
5
A
17
RST#
CLK
A
20
A
9
A
12
A
2
A
7
WE#
ADV#
A
19
A
10
A
13
A
1
A
14
WP#
D
12
A
16
WAIT
A
15
A
0
CE#
D
1
D
2
D
4
D
6
D
15
V
CCQ
OE#
D
0
D
9
D
10
D
11
D
13
D
14
V
SS
V
SSQ
D
8
V
CCQ
D
3
V
CC
D
5
V
SSQ
D
7
A
B
C
D
E
F
G
Top View - Ball Side Down
Complete Ink Mark Not Shown
Bottom View - Ball Side Up
8
7
6
5
4
3
2
1
1
2
3
4
5
6
7
8
A
21
A
22
A
22
A
21
2.3
Package Dimensions
Table 1. Package Outline Dimensions
Package
Type
Device
Density
Dimension-D
(± 0.1 mm)
Dimension-E
(± 0.1 mm)
Height
(max.) (mm)
VF BGA
32 Mbit
7.7 mm
9.0 mm
1.0 mm
μBGA*
64 Mbit
7.7 mm
9.0 mm
1.0 mm
Stacked-CSP
32/4, 64/8
14.0 mm
8.0 mm
1.4 mm
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