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參數(shù)資料
| 型號(hào)： | 80960RN |
| 廠商： | Intel Corp. |
| 英文描述： | 80960RN I/O Processor(80960RN I/O 處理器) |
| 中文描述： | 80960RN I / O處理器（80960RN的I / O處理器） |
| 文件頁數(shù)： | 39/54頁 |
| 文件大小： | 851K |
| 代理商： | 80960RN |
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Data Sheet
—
80960RN
Advance Information
39
3.2.1.3
Thermal Resistance
The thermal resistance value for the case-to-ambient,
θ
CA
, is used as a measure of the cooling
solution
’
s thermal performance.
3.2.2
Thermal Analysis
Table 12
lists the case-to-ambient thermal resistances of the 80960RN for different air flow rates
with and without a heat sink.
To calculate T
A
, the maximum ambient temperature to conform to a particular case temperature:
T
A
= T
C
- P (
θ
CA
)
Compute P by multiplying I
CC
and V
CC
. Values for
θ
JC
and
θ
CA
are given in
Table 12
.
Junction temperature (T
J
) is commonly used in reliability calculations. T
J
can be calculated from
θ
JC
(thermal resistance from junction to case) using the following equation:
T
J
= T
C
+ P (
θ
JC
)
Similarly, when T
A
is known, the corresponding case temperature (T
C
) can be calculated as
follows:
T
C
= T
A
+ P (
θ
CA
)
The
θ
JA
(Junction to Ambient) for this package is currently estimated at 5.38
°
C/Watt with no
airflow and no heatsink. The
θ
JA
(Junction to Ambient) for this package is currently estimated at
4.44
°
C/Watt with no airflow and a passive heatsink.
θ
JA
=
θ
JC
+
θ
CA
Table 12.
540-Lead H-PBGA Package Thermal Characteristics
Thermal Resistance
—
°
C/Watt
Parameter
Airflow
—
ft./min (m/sec)
0
(0)
50
(0.25)
100
(0.50)
200
(1.01)
300
(1.52)
400
(2.03)
600
(3.04)
800
(4.06)
θ
JC
(Junction-to-Case)
θ
(Case-to-Ambient)
Without Heatsink
0.3
0.3
0.3
0.3
0.3
0.3
0.3
0.3
5.08
4.45
4.08
3.73
3.47
3.25
2.92
2.68
θ
(Case-to-Ambient)
With Passive Heatsink
2
4.14
3.27
2.79
2.22
1.94
1.75
1.51
1.34
NOTES:
1. This table applies to a H-PBGA device soldered directly onto a board.
2. See
Table 13
for heatsink vendors.
θ
JA
θ
JC
θ
CA
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