STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
SIZE
A
84072
REVISION LEVEL
F
SHEET
3
DSCC FORM 2234
APR 97
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A
for device class M.
1.3 Absolute maximum ratings. 1/ 2/ 3/
Supply voltage range (V
CC
).................................................................................. -0.5 V dc to +7.0 V dc
DC input voltage range (V
IN
)................................................................................ -0.5 V dc to V
CC
+0.5 V dc
DC output voltage range (V
OUT
)........................................................................... -0.5 V dc to V
CC
+0.5 V dc
Input clamp current (I
IK
) (V
IN
< 0.0 or V
IN
> V
CC
)..................................................
±
20 mA
Output clamp current (I
OK
) (V
OUT
< 0.0 or V
OUT
> V
CC
).........................................
±
20 mA
Continuous output current (I
OUT
) (V
OUT
= 0.0 to V
CC
)...........................................
±
35 mA
Continuous current through V
CC
or GND.............................................................
±
70 mA
Storage temperature range (T
STG
)....................................................................... -65
°
C to +150
°
C
Maximum power dissipation (P
D
):........................................................................ 500 mW 4/
Lead temperature (soldering, 10 seconds).......................................................... +260
°
C
Thermal resistance, junction-to-case (
θ
JC
) .......................................................... See MIL-STD-1835
Junction temperature (T
J
).................................................................................... +175
°
C 5/
1.4 Recommended operating conditions. 2/ 3/
Supply voltage range (V
CC
).................................................................................. +2.0 V dc to +6.0 V dc
Case operating temperature range (T
C
) ............................................................. -55
°
C to +125
°
C
Input rise or fall time t
r
, t
f
):
VCC = 2.0 V ...................................................................................................... 0 to 1,000 ns
VCC = 4.5 V ...................................................................................................... 0 to 500 ns
VCC = 6.0 V ...................................................................................................... 0 to 400 ns
Minimum setup time, data before LE
↓
(t
s
):
T
C
= +25
°
C:
V
CC
= 2.0 V........................................................................................................ 100 ns
V
CC
= 4.5 V........................................................................................................ 20 ns
V
CC
= 6.0 V........................................................................................................ 17 ns
T
C
= -55
°
C to +125
°
C:
V
CC
= 2.0 V........................................................................................................ 150 ns
V
CC
= 4.5 V........................................................................................................ 30 ns
V
CC
= 6.0 V........................................................................................................ 26 ns
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ Unless otherwise noted, all voltages are referenced to GND.
3/ The limits for the parameters specified herein shall apply over the full specified V
CC
range and case temperature range of
-55
°
C to +125
°
C.
4/ For T
C
= +100
°
C to +125
°
C, derate linearly at 12 mW/
°
C.
5/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in
accordance with method 5004 of MIL-STD-883.