參數(shù)資料
型號: 845PE
廠商: Intel Corp.
英文描述: 82845GE Graphics and Memory Controller Hub (GMCH) and 82845PE Memory Controller Hub (MCH)
中文描述: 82845GE圖形和內(nèi)存控制器中樞(GMCH)和82845PE內(nèi)存控制器中樞(MCH)
文件頁數(shù): 5/176頁
文件大小: 2661K
代理商: 845PE
Intel
82845GE/82845PE
Datasheet
5
3.5.2.8
3.5.2.9
3.5.2.10 PBUSN1—Primary Bus Number Register (Device 1) .......80
3.5.2.11 SBUSN1—Secondary Bus Number Register (Device 1)...80
3.5.2.12 SUBUSN1—Subordinate Bus Number Register
(Device 1)..........................................................................81
3.5.2.13 SMLT1—Secondary Bus Master Latency Timer
Register (Device 1)............................................................81
3.5.2.14 IOBASE1—I/O Base Address Register (Device 1)............82
3.5.2.15 IOLIMIT1—I/O Limit Address Register (Device 1).............82
3.5.2.16 SSTS1—Secondary Status Register (Device 1) ...............83
3.5.2.17 MBASE1—Memory Base Address Register (Device 1)....84
3.5.2.18 MLIMIT1—Memory Limit Address Register (Device 1).....84
3.5.2.19 PMBASE1—Prefetchable Memory Base Address
Register (Device 1)............................................................85
3.5.2.20 PMLIMIT1—Prefetchable Memory Limit Address
Register (Device 1)............................................................85
3.5.2.21 BCTRL1—Bridge Control Register (Device 1) ..................86
3.5.2.22 ERRCMD1—Error Command Register (Device 1)............87
Integrated Graphics Device Registers (Device 2)
(Intel
82845GE only).......................................................................88
3.5.3.1
VID2—Vendor Identification Register (Device 2) ..............89
3.5.3.2
DID2—Device Identification Register (Device 2)...............89
3.5.3.3
PCICMD2—PCI Command Register (Device 2) ...............90
3.5.3.4
PCISTS2—PCI Status Register (Device 2).......................91
3.5.3.5
RID2—Revision Identification Register (Device 2)............91
3.5.3.6
CC—Class Code Register (Device 2) ...............................92
3.5.3.7
CLS—Cache Line Size Register (Device 2)......................92
3.5.3.8
MLT2—Master Latency Timer Register (Device 2)...........92
3.5.3.9
HDR2—Header Type Register (Device 2).........................93
3.5.3.10 GMADR —Graphics Memory Range Address
Register (Device 2)............................................................93
3.5.3.11 MMADR—Memory Mapped Range Address
Register (Device 2)............................................................94
3.5.3.12 SVID2—Subsystem Vendor Identification
Register (Device 2)............................................................94
3.5.3.13 SID2—Subsystem Identification Register (Device 2)........94
3.5.3.14 ROMADR—Video BIOS ROM Base Address
Registers (Device 2)..........................................................95
3.5.3.15 CAPPOINT—Capabilities Pointer Register (Device 2)......95
3.5.3.16 INTRLINE—Interrupt Line Register (Device 2)..................95
3.5.3.17 INTRPIN—Interrupt Pin Register (Device 2).....................96
3.5.3.18 MINGNT—Minimum Grant Register (Device 2) ................96
3.5.3.19 MAXLAT—Maximum Latency Register (Device 2)............96
3.5.3.20 PMCAPID—Power Management Capabilities ID
Register (Device 2)............................................................96
3.5.3.21 PMCAP—Power Management Capabilities
Register (Device 2)............................................................97
3.5.3.22 PMCS—Power Management Control/Status
Register (Device 2)............................................................97
Device 6 Registers............................................................................98
3.5.4.1
DWTC—DRAM Write Throttling Control
Register (Device 6)............................................................98
3.5.4.2
DRTC—DRAM Read Throttling Control
Register (Device 6)............................................................99
MLT1—Master Latency Timer Register (Device 1)...........79
HDR1—Header Type Register (Device 1).........................80
3.5.3
3.5.4
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