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參數(shù)資料
| 型號(hào)： | A3P1000L-FG144 |
| 廠商： | Microsemi SoC |
| 文件頁(yè)數(shù)： | 24/242頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC FPGA 1KB FLASH 1M 144-FBGA |
| 標(biāo)準(zhǔn)包裝： | 160 |
| 系列： | ProASIC3L |
| RAM 位總計(jì)： | 147456 |
| 輸入/輸出數(shù)： | 97 |
| 門數(shù)： | 1000000 |
| 電源電壓： | 1.14V ~ 1.575 V |
| 安裝類型： | 表面貼裝 |
| 工作溫度： | 0°C ~ 70°C |
| 封裝/外殼： | 144-LBGA |
| 供應(yīng)商設(shè)備封裝： | 144-FPBGA（13x13） |
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ProASIC3L Device Family Overview
1-6
Revision 13
User Nonvolatile FlashROM
ProASIC3L devices have 1 kbit of on-chip, user-accessible, nonvolatile FlashROM. The FlashROM can
be used in diverse system applications:
Internet Protocol addressing (wireless or fixed)
System calibration settings
Device serialization and/or inventory control
Subscription-based business models (for example, set-top boxes)
Secure key storage for secure communications algorithms
Asset management/tracking
Date stamping
Version management
The FlashROM is written using the standard ProASIC3L IEEE 1532 JTAG programming interface.The
core can be individually programmed (erased and written), and on-chip AES decryption can be used
selectively to securely load data over public networks, as in security keys stored in the FlashROM for a
user design.
The FlashROM can be programmed via the JTAG programming interface, and its contents can be read
back either through the JTAG programming interface or via direct FPGA core addressing. Note that the
FlashROM can only be programmed from the JTAG interface and cannot be programmed from the
internal logic array.
The FlashROM is programmed as 8 banks of 128 bits; however, reading is performed on a byte-by-byte
basis using a synchronous interface. A 7-bit address from the FPGA core defines which of the 8 banks
and which of the 16 bytes within that bank are being read. The three most significant bits (MSBs) of the
FlashROM address determine the bank, and the four least significant bits (LSBs) of the FlashROM
address define the byte.
The ProASIC3L development software solutions, Libero SoC and Designer, have extensive support for
the FlashROM. One such feature is auto-generation of sequential programming files for applications
requiring a unique serial number in each part. Another feature allows the inclusion of static data for
system version control. Data for the FlashROM can be generated quickly and easily using Libero SoC
and Designer software tools. Comprehensive programming file support is also included to allow for easy
programming of large numbers of parts with differing FlashROM contents.
SRAM and FIFO
ProASIC3L devices have embedded SRAM blocks along their north and south sides. Each variable-
aspect-ratio SRAM block is 4,608 bits in size. Available memory configurations are 256×18, 512×9,
1k×4, 2k×2, and 4k×1 bits. The individual blocks have independent read and write ports that can be
configured with different bit widths on each port. For example, data can be sent through a 4-bit port and
read as a single bitstream. The embedded SRAM blocks can be initialized via the device JTAG port
(ROM emulation mode) using the UJTAG macro.
In addition, every SRAM block has an embedded FIFO control unit. The control unit allows the SRAM
block to be configured as a synchronous FIFO without using additional core VersaTiles. The FIFO width
and depth are programmable. The FIFO also features programmable Almost Empty (AEMPTY) and
Almost Full (AFULL) flags in addition to the normal Empty and Full flags. The embedded FIFO control
unit contains the counters necessary for generation of the read and write address pointers. The
embedded SRAM/FIFO blocks can be cascaded to create larger configurations.
PLL and CCC
ProASIC3L devices provide designers with flexible clock conditioning circuit (CCC) capabilities. Each
member of the ProASIC3L family contains six CCCs. One CCC (center west side) has a PLL.
The six CCC blocks are located at the four corners and the centers of the east and west sides. One CCC
(center west side) has a PLL.
All six CCC blocks are usable; the four corner CCCs and the east CCC allow simple clock delay
operations as well as clock spine access.
The inputs of the six CCC blocks are accessible from the FPGA core or from one of several inputs
located near the CCC that have dedicated connections to the CCC block.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| ACC65DREF-S13 | CONN EDGECARD 130PS .100 EYELET |
| A3P1000L-FGG144 | IC FPGA 1KB FLASH 1M 144-FBGA |
| ABC65DREF-S13 | CONN EDGECARD 130PS .100 EYELET |
| M1A3P1000L-FGG144 | IC FPGA M1 1KB FLASH 1M 144FBGA |
| HCC65DRYS | CONN EDGECARD 130PS DIP .100 SLD |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| A3P1000L-FG144I | 功能描述:IC FPGA 1KB FLASH 1M 144-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:ProASIC3L 標(biāo)準(zhǔn)包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計(jì):- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FPBGA（27X27） |
| A3P1000L-FG256 | 功能描述:IC FPGA 1KB FLASH 1M 256-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:ProASIC3L 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA（17x17） |
| A3P1000L-FG256I | 功能描述:IC FPGA 1KB FLASH 1M 256-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:ProASIC3L 標(biāo)準(zhǔn)包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計(jì):- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FPBGA（27X27） |
| A3P1000L-FG484 | 功能描述:IC FPGA 1KB FLASH 1M 484-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:ProASIC3L 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA（17x17） |
| A3P1000L-FG484I | 功能描述:IC FPGA 1KB FLASH 1M 484-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:ProASIC3L 標(biāo)準(zhǔn)包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計(jì):- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FPBGA（27X27） |
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