參數(shù)資料
型號: AD5532HSABCZ
廠商: Analog Devices Inc
文件頁數(shù): 7/12頁
文件大?。?/td> 0K
描述: IC DAC 14BIT 32CH HS 74-CSPBGA
產(chǎn)品培訓(xùn)模塊: Data Converter Fundamentals
DAC Architectures
標準包裝: 1
設(shè)置時間: 10µs
位數(shù): 14
數(shù)據(jù)接口: 串行
轉(zhuǎn)換器數(shù)目: 34
電壓電源: 模擬和數(shù)字
功率耗散(最大): 623mW
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 74-LBGA,CSPBGA
供應(yīng)商設(shè)備封裝: 74-CSPBGA(12x12)
包裝: 托盤
輸出數(shù)目和類型: 32 電壓,單極
采樣率(每秒): 1.1M
配用: EVAL-AD5532HSEBZ-ND - BOARD EVAL FOR AD5532HS
EVAL-AD5532EBZ-ND - BOARD EVAL FOR AD5532
REV. 0
AD5532HS
–4–
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the AD5532HS features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
ABSOLUTE MAXIMUM RATINGS
1, 2
(TA = 25
°C unless otherwise noted)
VDD to AGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +17 V
VSS to AGND . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –17 V
AVCC to AGND, DAC_GND . . . . . . . . . . . . . –0.3 V to +7 V
DVCC to DGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Digital Inputs to DGND . . . . . . . . . . –0.3 V to DVCC + 0.3 V
REF_IN to AGND, DAC_GND . . . . . . . . . . . –0.3 V to +7 V
VOUT0–VOUT31 to AGND . . . . . . . VSS – 0.3 V to VDD + 0.3 V
VOUT0–VOUT31 to VSS . . . . . . . . . . . . . . . . . . –0.3 V to +24 V
OFFS_IN to AGND . . . . . . . . . . . VSS – 0.3 V to VDD + 0.3 V
AGND to DGND . . . . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V
Operating Temperature Range
Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . –40
°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65
°C to +150°C
Junction Temperature (TJ max) . . . . . . . . . . . . . . . . . . 150
°C
74-Lead LFBGA Package,
θJA Thermal Impedance . . . 41°C/W
Reflow Soldering
Peak Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 220
°C
Time at Peak Temperature . . . . . . . . . . . . 10 sec to 40 sec
Max Power Dissipation at TA = 70
°C,
Outputs Loaded . . . . . . . . . . . . . . . . . . . . . . . . . . 550 mW
3
(for TA > 70
°C, derate at 26 mW for each °C over 70°C)
NOTES
1 Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2 Transient currents of up to 100 mA will not cause SCR latch-up.
3 This limit includes load power and applies only when there is a resistive load on
VOUT outputs.
ORDERING GUIDE
Output
Package
Model
Function
Voltage Span
Description
Option
AD5532HSABC
32 DACs
5 V
74-Ball LFBGA
BC-74
OUTPUT
V
O
L
T
A
GE
DAC CODE
FULL-SCALE
ERROR
ACTUAL
IDEAL
OFFSET
ERROR
16k
0
Figure 2. DAC Transfer Function (OFFS_IN = 0)
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