參數(shù)資料
型號： AD9148BBCZRL
廠商： Analog Devices Inc
文件頁數(shù)： 72/72頁
文件大?。?/td> 0K
描述： IC DAC 16BIT QD 1GSPS 196CSPBGA
標準包裝： 1,500
系列： TxDAC+®
設置時間： 20ns
位數(shù)： 16
數(shù)據(jù)接口： 串行，SPI?
轉換器數(shù)目： 4
電壓電源： 模擬和數(shù)字
功率耗散（最大）： 2.22W
工作溫度： -40°C ~ 85°C
安裝類型： 表面貼裝
封裝/外殼： 196-LFBGA，CSPBGA
供應商設備封裝： 196-CSPBGA（12x12）
包裝： 帶卷 (TR)
輸出數(shù)目和類型： 8 電流，單極
采樣率（每秒）： 1G
Data Sheet
AD9148
Rev. B | Page 9 of 72
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
With
Respect To
Rating
AVDD33, IOVDD
AGND,
DGND,
CGND
0.3 V to +3.6 V
DVDD18, CVDD18
AGND,
DGND,
CGND
0.3 V to +2.10 V
AGND
DGND,
CGND
0.3 V to +0.3 V
DGND
AGND,
CGND
0.3 V to +0.3 V
CGND
AGND,
DGND
0.3 V to +0.3 V
I120, VREF
AGND
0.3 V to AVDD33 + 0.3 V
IOUT1_P, IOUT1_N,
IOUT2_P, IOUT2_N,
IOUT3_P, IOUT3_N,
IOUT4_P, IOUT4_N
AGND
1.0 V to AVDD33 + 0.3 V
A15_P to A0_P,
A15_N to A0_N,
B15_P to B0_P,
B15_N, B0_N
DGND
0.3 V to DVDD18 + 0.3 V
DCIA_P, DCIA_N,
FRAMEA_P, FRAMEA_N,
DCIB_P, DCIB_N,
FRAMEB_P, FRAMEB_N
DGND
0.3 V to DVDD18+ 0.3 V
CLK_P, CLK_N,
REFCLK_P, REFCLK_N
CGND
0.3 V to CVDD18 + 0.3 V
CSB, SCLK, SDIO, SDO,
TDO, TDI, TCK, TMS,
RESET, IRQ, PLL_LOCK
DGND
0.3 V to IOVDD + 0.3 V
Junction Temperature
125°C
Storage Temperature
Range
65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
Typical θJA, θJB, and θJC are specified vs. the number of PCB layers in
still air for each package offering. Airflow increases heat dissipation
effectively reducing θJA and θJB.
Table 7. Thermal Resistance
Package Type
θJA
θJB
θJC
Unit
Notes
196-Ball CSP_BGA
24.7
12.6
5.7
°C/W
4-layer board,
25 PCB vias
19.2
10.9
5.3
°C/W
8-layer board,
25 PCB vias
18.1
10.5
5.3
°C/W
10-layer board,
25 PCB vias
18.0
10.5
5.3
°C/W
12-layer board,
25 PCB vias
196-Ball BGA_ED
20.9
8.6
3.1
°C/W
4-layer board,
25 PCB vias
16.2
7.7
3.1
°C/W
8-layer board,
25 PCB vias
15.2
7.4
3.1
°C/W
10-layer board,
25 PCB vias
15.0
7.4
3.1
°C/W
12-layer board,
25 PCB vias
MAXIMUM SAFE POWER DISSIPATION
The maximum junction temperature for the AD9148 is 125°C.
With the thermal resistance of the molded package (CSP_BGA)
given for a 12 layer board, the maximum power that can be
dissipated in this package can be calculated as
(
) (
)
W
T
Power
JA
A
J
MAX
22
.
2
0
.
18
85
125
=
=
θ
=
To increase the maximum power, the AD9148 is available in a
second package option (BGA_ED), which includes a heat spreader
on top of the package. Also, an external heat sink can be attached to
the top of the AD9148 CSP_BGA package. The adjusted maximum
power for each of these conditions is shown in Table 8.
With the thermal resistance of the heat spreader package (BGA_ED)
given for a 12-layer board, the maximum power that can be
dissipated in this package can be calculated as
(
) (
)
W
T
Power
JA
A
J
MAX
67
.
2
0
.
15
85
125
=
=
θ
=
To increase the maximum power, an external heat sink can be
attached to the top of the AD9148 BGA_ED package. The adjusted
maximum power for an external heat sink is shown in Table 8.
To aid in the selection of package, the maximum fDAC rate for a given
power dissipation over several operating conditions is shown in
Table 9. The maximum fDACrate applies to all interpolation rates.
Note that, if the programmable inverse sinc filter is enabled, the
maximum fDAC rate specified in Table 9 decreases.
ESD CAUTION
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