參數(shù)資料
型號(hào)： AD9613-170EBZ
廠商： Analog Devices Inc
文件頁(yè)數(shù)： 29/36頁(yè)
文件大?。?/td> 0K
描述： BOARD EVAL FOR AD9613-170
標(biāo)準(zhǔn)包裝： 1
ADC 的數(shù)量： 2
位數(shù)： 12
采樣率（每秒）： 170M
數(shù)據(jù)接口： 串行，SPI?
輸入范圍： 1.75 Vpp
在以下條件下的電源（標(biāo)準(zhǔn)）： 670mW @ 170MSPS
工作溫度： -40°C ~ 85°C
已用 IC / 零件： AD9613
已供物品： 板
Data Sheet
AD9613
Rev. C | Page 35 of 36
APPLICATIONS INFORMATION
DESIGN GUIDELINES
Before starting system-level design and layout of the AD9613,
it is recommended that the designer become familiar with these
guidelines, which discuss the special circuit connections and
layout requirements needed for certain pins.
Power and Ground Recommendations
When connecting power to the AD9613, it is recommended
that two separate 1.8 V supplies be used: one supply should be
used for analog (AVDD), and a separate supply should be used
for the digital outputs (DRVDD). The designer can employ
several different decoupling capacitors to cover both high and
low frequencies. These capacitors should be located close to the
point of entry at the PC board level and close to the pins of the
part with minimal trace length.
A single PCB ground plane should be sufficient when using the
AD9613. With proper decoupling and smart partitioning of the
PCB analog, digital, and clock sections, optimum performance
is easily achieved.
Exposed Paddle Thermal Heat Slug Recommendations
It is mandatory that the exposed paddle on the underside of the
ADC be connected to analog ground (AGND) to achieve the
best electrical and thermal performance. A continuous, exposed
(no solder mask) copper plane on the PCB should mate to the
AD9613 exposed paddle, Pin 0.
The copper plane should have several vias to achieve the lowest
possible resistive thermal path for heat dissipation to flow through
the bottom of the PCB. These vias should be filled or plugged with
nonconductive epoxy.
To maximize the coverage and adhesion between the ADC
and the PCB, a silkscreen should be overlaid to partition the
continuous plane on the PCB into several uniform sections.
This provides several tie points between the ADC and the PCB
during the reflow process. Using one continuous plane with no
partitions guarantees only one tie point between the ADC and
the PCB. See the evaluation board for a PCB layout example.
For detailed information about the packaging and PCB layout
of chip-scale packages, refer to the AN-772 Application Note, A
Design and Manufacturing Guide for the Lead Frame Chip Scale
Package (LFCSP).
VCM
The VCM pin should be decoupled to ground with a 0.1 F
capacitor, as shown in Figure 48. For optimal channel-to-channel
isolation, a 33 resistor should be included between the AD9613
VCM pin and the Channel A analog input network connection,
as well as between the AD9613 VCM pin and the Channel B
analog input network connection.
SPI Port
The SPI port should not be active during periods when the full
dynamic performance of the converter is required. Because the
SCLK, CSB, and SDIO signals are typically asynchronous to the
ADC clock, noise from these signals can degrade converter
performance. If the on-board SPI bus is used for other devices,
it may be necessary to provide buffers between this bus and the
AD9613 to keep these signals from transitioning at the converter
input pins during critical sampling periods.
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