參數(shù)資料
型號： AD9613-170EBZ
廠商： Analog Devices Inc
文件頁數(shù)： 3/36頁
文件大?。?/td> 0K
描述： BOARD EVAL FOR AD9613-170
標(biāo)準(zhǔn)包裝： 1
ADC 的數(shù)量： 2
位數(shù)： 12
采樣率（每秒）： 170M
數(shù)據(jù)接口： 串行，SPI?
輸入范圍： 1.75 Vpp
在以下條件下的電源（標(biāo)準(zhǔn)）： 670mW @ 170MSPS
工作溫度： -40°C ~ 85°C
已用 IC / 零件： AD9613
已供物品： 板
Data Sheet
AD9613
Rev. C | Page 11 of 36
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
Rating
Electrical
AVDD to AGND
0.3 V to +2.0 V
DRVDD to AGND
0.3 V to +2.0 V
VIN+A/VIN+B, VINA/VINB to AGND
0.3 V to AVDD + 0.2 V
CLK+, CLK to AGND
0.3 V to AVDD + 0.2 V
SYNC to AGND
0.3 V to AVDD + 0.2 V
VCM to AGND
0.3 V to AVDD + 0.2 V
CSB to AGND
0.3 V to DRVDD + 0.3 V
SCLK to AGND
0.3 V to DRVDD + 0.3 V
SDIO to AGND
0.3 V to DRVDD + 0.3 V
OEB to AGND
0.3 V to DRVDD + 0.3 V
PDWN to AGND
0.3 V to DRVDD + 0.3 V
OR+/OR to AGND
0.3 V to DRVDD + 0.3 V
D0/D0+ Through D11/D11+ to
AGND
0.3 V to DRVDD + 0.3 V
DCO+/DCO to AGND
0.3 V to DRVDD + 0.3 V
Environmental
Operating Temperature Range
(Ambient)
40°C to +85°C
Maximum Junction Temperature
Under Bias
150°C
Storage Temperature Range
(Ambient)
65°C to +125°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL CHARACTERISTICS
The exposed paddle must be soldered to the ground plane for
the LFCSP package. Soldering the exposed paddle to the
printed circuit board (PCB) increases the reliability of the
solder joints, maximizing the thermal capability of the package.
Typical θJA is specified for a 4-layer PCB with solid ground
plane. As shown in Figure 40, airflow increases heat dissipation,
which reduces θJA. In addition, metal in direct contact with the
package leads from metal traces, through holes, ground, and
power planes reduces the θJA.
Table 7. Thermal Resistance
PackageType
Airflow
Velocity
(m/sec)
Unit
64-Lead LFCSP
9 mm × 9 mm
(CP-64-4)
0
26.8
1.14
10.4
°C/W
1.0
21.6
°C/W
2.0
20.2
°C/W
1
Per JEDEC 51-7, plus JEDEC 25-5 2S2P test board.
2
Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).
3
Per MIL-Std 883, Method 1012.1.
4
Per JEDEC JESD51-8 (still air).
ESD CAUTION
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