參數(shù)資料
型號(hào): AD9735BBCZRL
廠商: Analog Devices Inc
文件頁數(shù): 65/72頁
文件大小: 0K
描述: IC DAC 12BIT 1.2GSPS 160-CSPBGA
產(chǎn)品培訓(xùn)模塊: Data Converter Fundamentals
DAC Architectures
標(biāo)準(zhǔn)包裝: 1,500
位數(shù): 12
數(shù)據(jù)接口: 并聯(lián)
轉(zhuǎn)換器數(shù)目: 1
電壓電源: 模擬和數(shù)字
功率耗散(最大): 550mW
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 160-LFBGA,CSPBGA
供應(yīng)商設(shè)備封裝: 160-CSPBGA(12x12)
包裝: 帶卷 (TR)
輸出數(shù)目和類型: 2 電流,單極
采樣率(每秒): 1.2G
AD9734/AD9735/AD9736
Rev. A | Page 68 of 72
04862-
113
NOTES 1.
MATERIAL:
FOUR
LAYER,
FR4
GLASS
–EPOXY
LAMINATE
.062
+
/-
.007
THICK
1/4
OZ.
COPPER
CLAD
–EXTERNAL
LAYERS
PLATED
TO
1
OUNCE
2OZ.
COPPER
CLAD
–INTERNAL
LAYERS
2.
PLATED
THRU
HOLES
AND
THE
CONDUCTIVE
PATTERN
ELECTROPLATED
WITH
.001
INCH
MIN.
THICK
COPPER.
TERMINAL
AREAS
AND
EXPOSED
PLATED
THRU
HOLES
TO
B
E
COATED
WITH
SOLDER
AND
HOT
AIR
LEVELED.
3.
PROCESSING
TOLERANCES:
A.
CONDUCTIVE
PATTERN
FRON
TO
BACK
REGISTRATION
+
/–
.002
INCH
TOTAL
B.
MINIMUM
ANNULAR
RING
SURROUNDING
HOLES
.002
INCH.
C.
FINISHED
CONDUCTIVE
PATTERN
+
/–
.0005
INCH
OF
APERTURE
SIZE.
4.
WARP
AND
TWIST
+
/–
.005
INCH
PER
INCH.
5.
DIMENTIONS:
ARE
FOR
THE
FINISHED
PART
6.
SOLDER
MASK:
LIQUID
PHOTO
IMAGABLE
SOLDER
MASK
COLOR
GREEN,
BOTH
SIDES
USING
THE
PATTERN(S)
PROVIDED.
NO
MASK
IS
PERMITTED
ON
THE
EXPOSED
AREAS.
SOLDER
MASK
TO
ETCH
REGISTRATION
+
/–
.002
INCH
TOTAL
7.
SCREENING:
SCREEN
COMPONENT
OUTLINES
AND
NOMENCLATURE
USING
OPAQUE
WHITE
INK
ON
THE
PRIMARY
AND
SECONDARY
SIDES
(AS
REQUIRED).
NOMENCLATURE
SHALL
BE
LEGIBLE.
SCREEN
TO
ETCH
REGISTRATION
+
/–
.005
INCH
TOTAL.
8.
SURFACES:
PUNCHED
OR
MACHINED
SURFACES
125
MICRO
INCHES
RMS
MAX.
9.
BREAK
ALL
SHARP
EDGES
.015
R
MAX.
10.
FABRICATION
VENDOR
TO
ADD
UL
VENDOR
ID
NUMBER
IN
THIS
AREA
ON
THE
SECONDARY
SIDE
11.
DO
NOT
DRILL.
FOR
GOLD
PLATED
SOCKETED
VERSION
ONLY.
Figure 115. PCB Fabrication Detail, AD973x Evaluation Board, Rev. F
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