參數(shù)資料
型號(hào)： AD9779A-DPG2-EBZ
廠商： Analog Devices Inc
文件頁數(shù)： 56/56頁
文件大?。?/td> 0K
描述： BOARD EVALUATION FOR AD9779A
設(shè)計(jì)資源： Interfacing ADL5370 to AD9779A Dual-Channel, 1 GSPS High Speed DAC (CN0016)
Interfacing ADL5371 to AD9779A Dual-Channel, 1 GSPS High Speed DAC (CN0017)
Interfacing ADL5372 to AD9779A Dual-Channel, 1 GSPS High Speed DAC (CN0018)
Interfacing ADL5373 to AD9779A Dual-Channel, 1 GSPS High Speed DAC (CN0019)
Interfacing ADL5374 to AD9779A Dual-Channel, 1 GSPS High Speed DAC (CN0020)
Interfacing ADL5375 to AD9779A Dual-Channel, 1 GSPS High Speed DAC (CN0021)
AD9788-79A Eval Brd Schematic
AD9779A-DPG2-EBZ BOM
AD9779A-DPG2-EBZ Gerber Files
標(biāo)準(zhǔn)包裝： 1
系列： *
DAC 的數(shù)量： 2
位數(shù)： 16
采樣率（每秒）： 1G
數(shù)據(jù)接口： 串行
DAC 型： 電流
工作溫度： -40°C ~ 85°C
已供物品： *
已用 IC / 零件： AD9779A
AD9776A/AD9778A/AD9779A
Rev. B | Page 9 of 56
ABSOLUTE MAXIMUM RATINGS
Table 5.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Parameter
With Respect To
Rating
AVDD33, DVDD33
AGND, DGND,
CGND
0.3 V to +3.6 V
DVDD18, CVDD18
AGND, DGND,
CGND
0.3 V to +2.1 V
AGND
DGND, CGND
0.3 V to +0.3 V
DGND
AGND, CGND
0.3 V to +0.3 V
CGND
AGND, DGND
0.3 V to +0.3 V
I120, VREF, IPTAT
AGND
0.3 V to
AVDD33 + 0.3 V
OUT1_P, OUT1_N,
OUT2_P, OUT2_N,
AUX1_P, AUX1_N,
AUX2_P, AUX2_N
AGND
1.0 V to
AVDD33 + 0.3 V
P1D[15:0], P2D[15:0]
DGND
0.3 V to
DVDD33 + 0.3 V
DATACLK, TXENABLE
DGND
0.3 V to
DVDD33 + 0.3 V
REFCLK+, REFCLK
CGND
0.3 V to
CVDD18 + 0.3 V
RESET, IRQ, PLL_LOCK,
SYNC_O+, SYNC_O,
SYNC_I+, SYNC_I,
CSB, SCLK, SDIO, SDO
DGND
0.3 V to
DVDD33 + 0.3 V
Junction Temperature
+125°C
Storage Temperature
Range
65°C to +150°C
THERMAL RESISTANCE
For optimal thermal performance, the exposed paddle (EPAD)
should be soldered to the ground plane for the 100-lead,
thermally enhanced TQFP package.
Typical θJA and θJC are specified for a 4-layer board in still air.
Airflow increases heat dissipation, effectively reducing θJA.
Table 6. Thermal Resistance
Package Type
θJA
θJB
θJC
Unit
100-Lead TQFP
EPAD Soldered
19.1
12.4
7.1
°C/W
EPAD Not Soldered
27.4
°C/W
ESD CAUTION
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