參數(shù)資料
型號(hào)： AGLN125V5-FCSG81
元件分類： FPGA
英文描述： FPGA, PBGA81
封裝： 5 X 5 MM, 0.80 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, CSP-81
文件頁數(shù)： 24/114頁
文件大?。?/td> 3991K
代理商： AGLN125V5-FCSG81
IGLOO nano DC and Switching Characteristics
Ad vance v0.2
2-3
I/O Power-Up and Supply Voltage Thresholds for Power-On Reset
(Commercial and Industrial)
Sophisticated power-up management circuitry is designed into every IGLOO nano device. These
circuits ensure easy transition from the powered-off state to the powered-up state of the device.
The many different supplies can power up in any sequence with minimized current spikes or surges.
In addition, the I/O will be in a known state through the power-up sequence. The basic principle is
There are five regions to consider during power-up.
IGLOO nano I/Os are activated only if ALL of the following three conditions are met:
1. VCC and VCCI are above the minimum specified trip points (Figure 2-1 and Figure 2-2 on
2. VCCI > VCC – 0.75 V (typical)
3. Chip is in the operating mode.
VCCI Trip Point:
Ramping up (V5 devices): 0.6 V < trip_point_up < 1.2 V
Ramping down (V5 devices): 0.5 V < trip_point_down < 1.1 V
Ramping up (V2 devices): 0.75 V < trip_point_up < 1.05 V
Ramping down (V2 devices): 0.65 V < trip_point_down < 0.95 V
VCC Trip Point:
Ramping up (V5 devices): 0.6 V < trip_point_up < 1.1 V
Ramping down (V5 devices): 0.5 V < trip_point_down < 1.0 V
Ramping up (V2 devices): 0.65 V < trip_point_up < 1.05 V
Ramping down (V2 devices): 0.55 V < trip_point_down < 0.95 V
VCC and VCCI ramp-up trip points are about 100 mV higher than ramp-down trip points. This
specifically built-in hysteresis prevents undesirable power-up oscillations and current surges. Note
the following:
During programming, I/Os become tristated and weakly pulled up to VCCI.
JTAG supply, PLL power supplies, and charge pump VPUMP supply have no influence on I/O
behavior.
Table 2-4
Overshoot and Undershoot Limits 1
VCCI
Average VCCI–GND Overshoot or
Undershoot Duration
as a Percentage of Clock Cycle2
Maximum Overshoot/
Undershoot2
2.7 V or less
10%
1.4 V
5%
1.49 V
3 V
10%
1.1 V
5%
1.19 V
3.3 V
10%
0.79 V
5%
0.88 V
3.6 V
10%
0.45 V
5%
0.54 V
Notes:
1. Based on reliability requirements at 85°C.
2. The duration is allowed at one out of six clock cycles. If the overshoot/undershoot occurs at one out of two
cycles, the maximum overshoot/undershoot has to be reduced by 0.15 V.
相關(guān)PDF資料
PDF描述
AGLN125V5-FQN100 FPGA, PBCC100
AGLN125V5-FQNG100 FPGA, PBCC100
AGLN125V5-FVQ100 FPGA, PQFP100
AGLN125V5-FVQG100 FPGA, PQFP100
AGLN125V5-QN100I FPGA, PBCC100
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AGLN125V5-QNG100 制造商:Microsemi Corporation 功能描述:FPGA IGLOO NANO FAMILY 125K GATES 130NM (CMOS) TECHNOLOGY 1. - Trays
AGLN125V5-QNG100I 制造商:Microsemi Corporation 功能描述:FPGA IGLOO NANO FAMILY 125K GATES 130NM (CMOS) TECHNOLOGY 1. - Trays
AGLN125V5-VQ100 功能描述:IC FPGA NANO 1KB 125K 100VQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:IGLOO nano 標(biāo)準(zhǔn)包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計(jì):- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA，CSBGA 供應(yīng)商設(shè)備封裝:289-CSP（14x14）
AGLN125V5-VQ100I 功能描述:IC FPGA NANO 1KB 125K 100VQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:IGLOO nano 標(biāo)準(zhǔn)包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計(jì):- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA，CSBGA 供應(yīng)商設(shè)備封裝:289-CSP（14x14）
AGLN125V5-VQG100 功能描述:IC FPGA 125K 1.5V 100VTQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:IGLOO nano 標(biāo)準(zhǔn)包裝:24 系列:ECP2 LAB/CLB數(shù):1500 邏輯元件/單元數(shù):12000 RAM 位總計(jì):226304 輸入/輸出數(shù):131 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:208-BFQFP 供應(yīng)商設(shè)備封裝:208-PQFP（28x28）
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